Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12055382 | Strain distribution measurement system and strain distribution measurement method that measure strain distribution based on distribution of reflectance or polarization characteristic | Tomotaka Nagashima, Yukimitsu IWANAGA | 2024-08-06 |
| 11753751 | Surface-colored glass cloth and fiber-reinforced resin molded product | Hideaki Monma, Kazunori Sano | 2023-09-12 |
| 11739807 | Energy absorption member | Shunsuke HARASHIMA, Kazunori Sano, Kazuhiro Sakata | 2023-08-29 |
| 11040908 | Glass fiber production method | Takashi Nonaka, Kazuaki Minami, Yosuke NUKUI | 2021-06-22 |
| 9878942 | Glass composition for glass fiber | Takashi Nonaka, Kazuaki Minami, Yosuke NUKUI | 2018-01-30 |
| 8689586 | Glass-melting device for producing glass fiber and method for producing glass fiber | Naohiro Miyanaga, Masahiko Takahashi, Kentarou Ogawa | 2014-04-08 |
| 8689588 | Glass-melting device for producing glass fiber and method for producing glass fiber using same | Masahiko Takahashi, Naohiro Miyanaga, Kentarou Ogawa | 2014-04-08 |
| 8530053 | Heat-resistant composite material | Hirofumi Nishida | 2013-09-10 |
| 7547412 | Composite material, method for producing same and member using same | Masayuki Itoh, Tadashi Arikawa, Yoshinari Amano, Nobuyuki Saitoh | 2009-06-16 |
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions | Mitsuo Osada, Tadashi Arikawa, Yoshinari Amano, Hidetoshi Maesato, Hidefumi Hayashi +1 more | 2006-08-01 |
| 6926861 | Semiconductor package and method for producing heat-radiating substrate for it | Mitsuo Osada, Akira Ichida, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2005-08-09 |
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it | Mitsuo Osada, Akira Ichida, Yoshinari Amano, Kiyoshi Asai, Hidetoshi Maesato +2 more | 2004-02-17 |
| 6475429 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Akira Ichida, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa | 2002-11-05 |
| 6271585 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Akira Ichida, Kiyoshi Asai, Hidetoshi Maesato, Tadashi Arikawa | 2001-08-07 |