Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7083759 | Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions | Mitsuo Osada, Norio Hirayama, Tadashi Arikawa, Yoshinari Amano, Hidefumi Hayashi +1 more | 2006-08-01 |
| 6926861 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Akira Ichida, Yoshinari Amano, Kiyoshi Asai +2 more | 2005-08-09 |
| 6693353 | Semiconductor package and method for producing heat-radiating substrate for it | Norio Hirayama, Mitsuo Osada, Akira Ichida, Yoshinari Amano, Kiyoshi Asai +2 more | 2004-02-17 |
| 6475429 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Akira Ichida, Norio Hirayama, Kiyoshi Asai, Tadashi Arikawa | 2002-11-05 |
| 6271585 | Heat sink substrate consisting essentially of copper and molybdenum and method of manufacturing the same | Mitsuo Osada, Akira Ichida, Norio Hirayama, Kiyoshi Asai, Tadashi Arikawa | 2001-08-07 |