Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5708959 | Substrate for semiconductor apparatus | Mituo Osada, Yoshinari Amano, Akira Ohtsuka | 1998-01-13 |
| 5563101 | Substrate for semiconductor apparatus | Mituo Osada, Yoshinari Amano, Akira Ohtsuka | 1996-10-08 |
| 5525428 | Substrate for semiconductor apparatus | Mituo Osada, Yoshinari Amano, Akira Ohtsuka | 1996-06-11 |
| 5409864 | Substrate for semiconductor apparatus | Mituo Osada, Yoshinari Amano, Akira Ohtsuka | 1995-04-25 |
| 5370907 | Forming a metallized layer on an AlN substrate by applying and heating a paste of a metal composed of W and Mo | Akira Yamakawa | 1994-12-06 |
| 5229549 | Ceramic circuit board and a method of manufacturing the ceramic circuit board | Akira Yamakawa, Mitsuo Osada | 1993-07-20 |
| 5099310 | Substrate for semiconductor apparatus | Mituo Osada, Yoshinari Amano, Akira Ohtusuka | 1992-03-24 |
| 5086333 | Substrate for semiconductor apparatus having a composite material | Mituo Osada, Yoshinari Amano, Akira Ohtsuka | 1992-02-04 |
| 4480013 | Substrate for use in semiconductor apparatus | Yoshihiko Doi, Akira Ohtsuka, Tadashi Igarashi | 1984-10-30 |