Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density

Coreless architecture and processing strategy for EMIB-based substrates with high accuracy and high density

US Patent 12142567 · Granted Nov 12, 2024

Estimated economic value: $28,491,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Ultra-thin, hyper-density semiconductor packages2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Nested glass packaging architecture for hybrid electrical and optical communicat2025
Microelectronic structures including bridges2025
Edge-aligned template structure for integrated circuit packages2025
Ultra-thin, hyper-density semiconductor packages2025
Stripped redistrubution-layer fabrication for package-top embedded multi-die int2025
Omni directional interconnect with magnetic fillers in mold matrix2025
First layer interconnect first on carrier approach for EMIB patch2025
Interconnect architecture with silicon interposer and EMIB2025