Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676900 | Electronic assembly that includes a bridge | Eric J. Li, Shawna M. Liff, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin | 2023-06-13 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Mitul Modi, Edvin Cetegen, Aastha Uppal +8 more | 2023-01-03 |
| 11521931 | Microelectronic structures including bridges | Jason M. Gamba, Mohit Bhatia, Omkar G. Karhade, Bai Nie, Gang Duan +2 more | 2022-12-06 |
| 11522291 | Antenna boards and communication devices | Omkar G. Karhade, William J. Lambert, Xiaoqian Li, Debendra Mallik | 2022-12-06 |
| 11373972 | Microelectronic structures including bridges | Omkar G. Karhade, Mohit Bhatia, Anurag Tripathi, Takeshi Nakazawa, Steve Cho | 2022-06-28 |
| 11328937 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2022-05-10 |
| 11254563 | Mold material architecture for package device structures | Omkar G. Karhade | 2022-02-22 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson +6 more | 2022-01-11 |
| 11114388 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade | 2021-09-07 |
| 11056466 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Christopher L. Rumer, Robert M. Nickerson | 2021-07-06 |
| 10797000 | Embedded multi-device bridge with through-bridge conductive via signal connection | Omkar G. Karhade | 2020-10-06 |
| 10741419 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2020-08-11 |
| 10672626 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li | 2020-06-02 |
| 10595409 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, John S. Guzek | 2020-03-17 |
| 10438930 | Package on package thermal transfer systems and methods | Omkar G. Karhade, Christopher L. Rumer, Robert M. Nickerson | 2019-10-08 |
| 10403512 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2019-09-03 |
| 10256198 | Warpage control for microelectronics packages | Eric J. Li, Guotao Wang, Huiyang Fei, Sairam Agraharam, Omkar G. Karhade | 2019-04-09 |
| 10229882 | Embedded multi-device bridge with through-bridge conductive via signal connection | Omkar G. Karhade | 2019-03-12 |
| 10192810 | Underfill material flow control for reduced die-to-die spacing in semiconductor packages | Omkar G. Karhade, Rajendra C. Dias, Edvin Cetegen, Lars D. Skoglund | 2019-01-29 |
| 10068852 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Shawna M. Liff | 2018-09-04 |
| 9991243 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-06-05 |
| 9941246 | Electronic assembly that includes stacked electronic devices | Ravi Mahajan | 2018-04-10 |
| 9899238 | Low cost package warpage solution | Omkar G. Karhade, Debendra Mallik, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-02-20 |
| 9842832 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, William J. Lambert +6 more | 2017-12-12 |