Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9795038 | Electronic package design that facilitates shipping the electronic package | Omkar G. Karhade, Nachiket R. Raravikar | 2017-10-17 |
| 9754890 | Embedded multi-device bridge with through-bridge conductive via signal connection | Omkar G. Karhade | 2017-09-05 |
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Edvin Cetegen, Eric J. Li, Debendra Mallik, Bassam M. Ziadeh | 2017-08-22 |
| 9716067 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Shawna M. Liff | 2017-07-25 |
| 9713255 | Electro-magnetic interference (EMI) shielding techniques and configurations | Adel A. Elsherbini, Ravindranath V. Mahajan, John S. Guzek | 2017-07-18 |
| 9691711 | Method of making an electromagnetic interference shield for semiconductor chip packages | Ravindranath V. Mahajan, John S. Guzek, Adel A. Elsherbini | 2017-06-27 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa | 2017-06-20 |
| 9685421 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Ravindranath V. Mahajan, Omkar G. Karhade | 2017-06-20 |
| 9659899 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li +2 more | 2017-05-23 |
| 9607964 | Method and materials for warpage thermal and interconnect solutions | Omkar G. Karhade, Aditya Sundoctor VAIDYA, Nachiket R. Raravikar, Eric J. Li | 2017-03-28 |
| 9583470 | Electronic device with solder pads including projections | Omkar G. Karhade | 2017-02-28 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Bassam M. Ziadeh, Yoshihiro Tomita | 2017-02-21 |
| 9502368 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa | 2016-11-22 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, William J. Lambert +6 more | 2016-07-19 |
| 9368455 | Electromagnetic interference shield for semiconductor chip packages | Ravindranath V. Mahajan, John S. Guzek, Adel A. Elsherbini | 2016-06-14 |
| 9275955 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Shawna M. Liff | 2016-03-01 |
| 9180541 | Rotational-flow spray nozzle and process of using same | Harikrishnan Ramanan, Sabina J. Houle | 2015-11-10 |
| 9123732 | Die warpage control for thin die assembly | Sandeep B. Sane, Shankar Ganapathysubramanian, Jorge Sanchez, Leonel Arana, Eric J. Li +2 more | 2015-09-01 |
| 9076882 | Methods for high precision microelectronic die integration | Aleksandar Aleksov, Ravindranath V. Mahajan, Omkar G. Karhade | 2015-07-07 |
| 8215536 | Rotational-flow spray nozzle and process of using same | Harikrishnan Ramanan, Sabina J. Houle | 2012-07-10 |
| 7644871 | Flux spray atomization and splash control | Harikrishnan Ramanan, Sabina J. Houle, Michael B. Colella, Nagaratnam Murugaiah | 2010-01-12 |
| 7534715 | Methods including fluxless chip attach processes | Susheel Jadhav, Daoqiang Lu | 2009-05-19 |
| 7411296 | Method, system, and apparatus for gravity assisted chip attachment | Shubhada H. Sahasrabudhe | 2008-08-12 |
| 7312527 | Low temperature phase change thermal interface material dam | Sandeep B. Sane, Chia-Pin Chiu | 2007-12-25 |
| 7166540 | Method for reducing assembly-induced stress in a semiconductor die | Sandeep B. Sane | 2007-01-23 |