Issued Patents All Time
Showing 26–50 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11608564 | Helical plated through-hole package inductor | Mihir K. Roy, Mathew J. Manusharow, Yikang Deng | 2023-03-21 |
| 11522291 | Antenna boards and communication devices | Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Debendra Mallik | 2022-12-06 |
| 11380652 | Multi-level distributed clamps | Beomseok Choi, Kaladhar Radhakrishnan, Michael J. Hill, Krishna Bharath | 2022-07-05 |
| 11380979 | Antenna modules and communication devices | Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, Benjamin Jann | 2022-07-05 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Shawna M. Liff, Zhichao Zhang, Robert L. Sankman, Sri Chaitra Jyotsna Chavali | 2022-06-07 |
| 11335620 | Package inductor having thermal solution structures | Michael J. Hill, Anne Augustine, Huong Do | 2022-05-17 |
| 11335618 | Thermals for packages with inductors | — | 2022-05-17 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Robert L. Sankman, Aleksandar Aleksov +6 more | 2022-01-18 |
| 11215662 | Method, device and system to protect circuitry during a burn-in process | Kaladhar Radhakrishnan, Michael J. Hill | 2022-01-04 |
| 11211866 | Reconfigurable inductor | Kaladhar Radhakrishnan, Beomseok Choi, Krishna Bharath, Michael J. Hill | 2021-12-28 |
| 11121468 | Antenna modules and communication devices | Sidharth Dalmia, Trang Thai, Zhichao Zhang, Jiwei Sun | 2021-09-14 |
| 11112841 | 5G mmWave cooling through PCB | Divya Mani, Shawna M. Liff, Sergio Antonio Chan Arguedas, Robert L. Sankman | 2021-09-07 |
| 11107757 | Integrated circuit structures in package substrates | Sanka Ganesan, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2021-08-31 |
| 10998120 | Method of making an inductor | Mihir K. Roy, Mathew J. Manusharow, Yikang Deng | 2021-05-04 |
| 10868366 | Package architecture for antenna arrays | Adel A. Elsherbini, Shawna M. Liff | 2020-12-15 |
| 10797394 | Antenna modules and communication devices | Sidharth Dalmia, Trang Thai, Zhichao Zhang, Jiwei Sun | 2020-10-06 |
| 10741536 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala +1 more | 2020-08-11 |
| 10672693 | Integrated circuit structures in package substrates | Sanka Ganesan, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more | 2020-06-02 |
| 10658765 | Edge-firing antenna walls built into substrate | Sri Chaitra Jyotsna Chavali, Sanka Ganesan, Debendra Mallik, Zhichao Zhang | 2020-05-19 |
| 10503227 | Apparatus and method to reduce power losses in an integrated voltage regulator | Krishna Bharath, Srikrishnan Venkataraman, Michael J. Hill, Alexander Slepoy, Dong Zhong +3 more | 2019-12-10 |
| 10340260 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala +1 more | 2019-07-02 |
| 10163557 | Helical plated through-hole package inductor | Mihir K. Roy, Mathew J. Manusharow, Yikang Deng | 2018-12-25 |
| 10157860 | Component stiffener architectures for microelectronic package structures | Omkar G. Karhade, Kedar Dhane, Yongki Min | 2018-12-18 |
| 9992871 | Systems and methods for controlled effective series resistance component | Mathew J. Manusharow | 2018-06-05 |
| 9911723 | Magnetic small footprint inductor array module for on-package voltage regulator | Yongki Min, Reynaldo A. Olmedo, Kaladhar Radhakrishnan, Leigh E. Wojewoda, Venkat Anil K. Magadala +1 more | 2018-03-06 |