Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations

Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations

US Patent 12132015 · Granted Oct 29, 2024

Estimated economic value: $18,861,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra-thin, hyper-density semiconductor packages2025
Ultra-thin, hyper-density semiconductor packages2025
Power delivery through capacitor-dies in a multi-layered microelectronic assembl2025
Microelectronic assemblies with direct attach to circuit boards2025
Coreless electronic substrates having embedded inductors2025
Package with underfill containment barrier2025
Packaging architecture for disaggregated integrated voltage regulators2025
Conformal power delivery structure for direct chip attach architectures2025
Embedded die architecture and method of making2025
Antenna modules and communication devices2025
Integrating voltage regulators and passive circuit elements with top side power 2025
Magnetic core inductors in interposer2025