Issued Patents All Time
Showing 26–50 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476213 | Bonded structures without intervening adhesive | Belgacem Haba, Rajesh Katkar, Javier A. Delacruz | 2022-10-18 |
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2022-08-23 |
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2022-08-16 |
| 11387202 | Nanowire bonding interconnect for fine-pitch microelectronics | Belgacem Haba | 2022-07-12 |
| 11348898 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar | 2022-05-31 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2022-02-22 |
| 11256004 | Direct-bonded lamination for improved image clarity in optical devices | Belgacem Haba, Rajesh Katkar | 2022-02-22 |
| 11246230 | Configurable smart object system with methods of making modules and contactors | Belgacem Haba, Gabriel Z. Guevara, Min Tao | 2022-02-08 |
| 11244477 | Compressive sensing based image processing | — | 2022-02-08 |
| 11239587 | Configurable smart object system with clip-based connectors | Belgacem Haba, Gabriel Z. Guevara, Min Tao | 2022-02-01 |
| 11152336 | 3D processor having stacked integrated circuit die | Steven Teig, Kenneth Duong, Javier A. Delacruz | 2021-10-19 |
| 11094090 | Compressive sensing based image capture using diffractive mask | — | 2021-08-17 |
| 11024220 | Formation of a light-emitting diode display | Liang Wang, Rajesh Katkar, Javier A. Delacruz, Belgacem Haba | 2021-06-01 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Cyprian Emeka Uzoh | 2021-05-18 |
| 11004930 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Piyush Savalia | 2021-05-11 |
| 10991676 | Systems and methods for flash stacking | Belgacem Haba, Javier A. Delacruz | 2021-04-27 |
| 10978348 | 3D chip sharing power interconnect layer | Javier A. Delacruz, Steven Teig | 2021-04-13 |
| 10969593 | Remote optical engine for virtual reality or augmented reality headsets | Belgacem Haba, Rajesh Katkar | 2021-04-06 |
| 10955671 | Stretchable film assembly with conductive traces | Belgacem Haba, Gabriel Z. Guevara, Min Tao | 2021-03-23 |
| 10950547 | Stacked IC structure with system level wiring on multiple sides of the IC die | Steven Teig, Javier A. Delacruz | 2021-03-16 |
| 10937196 | Compressive sensing based image capture device | — | 2021-03-02 |
| 10910344 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar | 2021-02-02 |
| 10892252 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Javier A. Delacruz, Laura Mirkarimi | 2021-01-12 |
| 10886177 | 3D chip with shared clock distribution network | Javier A. Delacruz, Steven Teig | 2021-01-05 |
| 10887537 | Compressive sensing based image capture using dynamic masking | — | 2021-01-05 |