Issued Patents All Time
Showing 76–100 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10529634 | Probe methodology for ultrafine pitch interconnects | Javier A. Delacruz, Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2020-01-07 |
| 10508030 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao | 2019-12-17 |
| 10510659 | Substrate-less stackable package with wire-bond interconnect | — | 2019-12-17 |
| 10460958 | Method of manufacturing embedded packaging with preformed vias | Belgacem Haba | 2019-10-29 |
| 10396041 | High yield substrate assembly | Liang Wang, Masud Beroz | 2019-08-27 |
| 10354942 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2019-07-16 |
| 10297582 | BVA interposer | Terrence Caskey, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more | 2019-05-21 |
| 10290612 | Systems and methods for flash stacking | Belgacem Haba, Javier A. Delacruz | 2019-05-14 |
| 10290589 | Folding thin systems | Belgacem Haba | 2019-05-14 |
| 10283449 | Low stress vias | Belgacem Haba, Cyprian Emeka Uzoh | 2019-05-07 |
| 10262947 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2019-04-16 |
| 10199275 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Vage Oganesian | 2019-02-05 |
| 10170412 | Substrate-less stackable package with wire-bond interconnect | — | 2019-01-01 |
| 10159148 | Porous alumina templates for electronic packages | Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2018-12-18 |
| 10157978 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Piyush Savalia | 2018-12-18 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2018-08-28 |
| 10015881 | Cavities containing multi-wiring structures and devices | Cyprian Emeka Uzoh, Craig Mitchell, Belgacem Haba | 2018-07-03 |
| 9984901 | Method for making a microelectronic assembly having conductive elements | Belgacem Haba, Teck-Gyu Kang, Ellis Chau | 2018-05-29 |
| 9966303 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2018-05-08 |
| 9953914 | Substrate-less stackable package with wire-bond interconnect | — | 2018-04-24 |
| 9947643 | Inverted optical device | Masud Beroz, Liang Wang | 2018-04-17 |
| 9917073 | Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package | — | 2018-03-13 |
| 9899353 | Off-chip vias in stacked chips | Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2018-02-20 |
| 9876002 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Terrence Caskey | 2018-01-23 |
| 9859220 | Laminated chip having microelectronic element embedded therein | Vage Oganesian, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2018-01-02 |