Issued Patents All Time
Showing 126–150 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9496236 | Interconnect structure | Debabrata Gupta, Yukio Hashimoto, Laura Wills Mirkarimi, Rajesh Katkar | 2016-11-15 |
| 9484333 | Multi-chip module with stacked face-down connected dies | Belgacem Haba, Piyush Savalia | 2016-11-01 |
| 9461196 | Non-crystalline inorganic light emitting diode | Liang Wang | 2016-10-04 |
| 9455181 | Vias in porous substrates | Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia | 2016-09-27 |
| 9437579 | Multiple die face-down stacking for two or more die | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Frank Lambrecht | 2016-09-06 |
| 9437557 | High density three-dimensional integrated capacitors | Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia, Vage Oganesian | 2016-09-06 |
| 9431475 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Piyush Savalia | 2016-08-30 |
| 9433100 | Low-stress TSV design using conductive particles | Charles G. Woychik, Kishor Desai, Terrence Caskey | 2016-08-30 |
| 9406532 | Interposer having molded low CTE dielectric | Belgacem Haba | 2016-08-02 |
| 9391008 | Reconstituted wafer-level package DRAM | — | 2016-07-12 |
| 9390998 | Heat spreading substrate | Liang Wang, Gabriel Z. Guevara | 2016-07-12 |
| 9378985 | Method of thinning a wafer to provide a raised peripheral edge | Belgacem Haba | 2016-06-28 |
| 9368476 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2016-06-14 |
| 9362203 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2016-06-07 |
| 9356006 | Batch process fabrication of package-on-package microelectronic assemblies | Belgacem Haba, Liang Wang | 2016-05-31 |
| 9355996 | Microelectronic package with consolidated chip structures | Belgacem Haba, Richard Dewitt Crisp, Wael Zohni | 2016-05-31 |
| 9355959 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2016-05-31 |
| 9355948 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2016-05-31 |
| 9355901 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2016-05-31 |
| 9349672 | Microelectronic package | Belgacem Haba, Sean Moran, Wei-Shun Wang, Ellis Chau, Christopher Wade | 2016-05-24 |
| 9337165 | Method for manufacturing a fan-out WLP with package | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2016-05-10 |
| 9330954 | Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof | Belgacem Haba | 2016-05-03 |
| 9324681 | Pin attachment | Belgacem Haba | 2016-04-26 |
| 9318385 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Vage Oganesian | 2016-04-19 |
| 9319499 | Wearable ultra-thin miniaturized mobile communications | Stuart E. Wilson, Charles White, Hari Chakravarthula | 2016-04-19 |