Issued Patents All Time
Showing 176–200 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9095074 | Structure for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Terrence Caskey, Reynaldo Co, Ellis Chau | 2015-07-28 |
| 9070849 | Parallel plate slot emission array | Liang Wang, Steven Dean Gottke | 2015-06-30 |
| 9048234 | Off-chip vias in stacked chips | Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2015-06-02 |
| 9041133 | BSI image sensor package with embedded absorber for even reception of different wavelengths | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2015-05-26 |
| 9034696 | Microelectronic assemblies having reinforcing collars on connectors extending through encapsulation | Belgacem Haba | 2015-05-19 |
| 9023691 | Microelectronic assemblies with stack terminals coupled by connectors extending through encapsulation | Belgacem Haba | 2015-05-05 |
| 9018769 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2015-04-28 |
| 9013033 | Multiple die face-down stacking for two or more die | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp, Frank Lambrecht | 2015-04-21 |
| 8988895 | Interconnection elements with encased interconnects | Belgacem Haba | 2015-03-24 |
| 8975751 | Vias in porous substrates | Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia | 2015-03-10 |
| 8975738 | Structure for microelectronic packaging with terminals on dielectric mass | Belgacem Haba | 2015-03-10 |
| 8975616 | Quantum efficiency of multiple quantum wells | Liang Wang, Masud Beroz | 2015-03-10 |
| 8956916 | Multi-chip module with stacked face-down connected dies | Belgacem Haba, Piyush Savalia | 2015-02-17 |
| 8957520 | Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts | Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2015-02-17 |
| 8951845 | Methods of fabricating a flip chip package for dram with two underfill materials | Kazuo Sakuma, Philip Damberg | 2015-02-10 |
| 8946757 | Heat spreading substrate with embedded interconnects | Masud Beroz | 2015-02-03 |
| 8941111 | Non-crystalline inorganic light emitting diode | Liang Wang | 2015-01-27 |
| 8937361 | BSI image sensor package with variable-height silicon for even reception of different wavelengths | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2015-01-20 |
| 8916781 | Cavities containing multi-wiring structures and devices | Belgacem Haba, Craig Mitchell, Cyprian Emeka Uzoh | 2014-12-23 |
| 8912024 | Front facing piggyback wafer assembly | Masud Beroz, Liang Wang | 2014-12-16 |
| 8900974 | High yield substrate assembly | Liang Wang, Masud Beroz | 2014-12-02 |
| 8890327 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Belgacem Haba | 2014-11-18 |
| 8890304 | Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2014-11-18 |
| 8883563 | Fabrication of microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation | Belgacem Haba | 2014-11-11 |
| 8878353 | Structure for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Terrence Caskey, Reynaldo Co, Ellis Chau | 2014-11-04 |