Issued Patents All Time
Showing 151–175 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293641 | Inverted optical device | Masud Beroz, Liang Wang | 2016-03-22 |
| 9287216 | Memory module in a package | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp | 2016-03-15 |
| 9287164 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Vage Oganesian, Craig Mitchell, Belgacem Haba | 2016-03-15 |
| 9269692 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2016-02-23 |
| 9263413 | Substrate-less stackable package with wire-bond interconnect | — | 2016-02-16 |
| 9226396 | Porous alumina templates for electronic packages | Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2015-12-29 |
| 9224717 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-12-29 |
| 9224649 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2015-12-29 |
| 9218988 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ellis Chau | 2015-12-22 |
| 9214454 | Batch process fabrication of package-on-package microelectronic assemblies | Belgacem Haba, Liang Wang | 2015-12-15 |
| 9214425 | Low-stress vias | Belgacem Haba, Cyprian Emeka Uzoh | 2015-12-15 |
| 9196581 | Flow underfill for microelectronic packages | Belgacem Haba, Ellis Chau, Sang Il Lee, Kishor Desai | 2015-11-24 |
| 9190463 | High density three-dimensional integrated capacitors | Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia, Vage Oganesian | 2015-11-17 |
| 9167710 | Embedded packaging with preformed vias | Belgacem Haba | 2015-10-20 |
| 9165906 | High performance package on package | Belgacem Haba | 2015-10-20 |
| 9165911 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Terrence Caskey | 2015-10-20 |
| 9142508 | Single exposure in multi-damascene process | Cyprian Emeka Uzoh, Vage Oganesian, Craig Mitchell, Belgacem Haba | 2015-09-22 |
| 9137903 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more | 2015-09-15 |
| 9123600 | Microelectronic package with consolidated chip structures | Belgacem Haba, Richard Dewitt Crisp, Wael Zohni | 2015-09-01 |
| 9125333 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2015-09-01 |
| 9111946 | Method of thinning a wafer to provide a raised peripheral edge | Belgacem Haba | 2015-08-18 |
| 9105612 | Microelectronic packages having cavities for receiving microelectronic elements | Belgacem Haba, Wael Zohni, Philip R. Osborn | 2015-08-11 |
| 9099296 | Stacked microelectronic assembly with TSVS formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2015-08-04 |
| 9099479 | Carrier structures for microelectronic elements | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2015-08-04 |
| 9093435 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-07-28 |