Issued Patents All Time
Showing 201–225 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8865570 | Chips with high fracture toughness through a metal ring | — | 2014-10-21 |
| 8853558 | Interconnect structure | Debabrata Gupta, Yukio Hashimoto, Laura Wills Mirkarimi, Rajesh Katkar | 2014-10-07 |
| 8847376 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-09-30 |
| 8847380 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-09-30 |
| 8841765 | Multi-chip module with stacked face-down connected dies | Belgacem Haba, Piyush Savalia | 2014-09-23 |
| 8841763 | Three-dimensional system-in-a-package | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2014-09-23 |
| 8841204 | High yield substrate assembly | Liang Wang, Masud Beroz | 2014-09-23 |
| 8835223 | Chip assembly having via interconnects joined by plating | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-09-16 |
| 8835228 | Substrate-less stackable package with wire-bond interconnect | — | 2014-09-16 |
| 8823165 | Memory module in a package | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp | 2014-09-02 |
| 8816505 | Low stress vias | Belgacem Haba, Cyprian Emeka Uzoh | 2014-08-26 |
| 8816383 | High performance light emitting diode with vias | Liang Wang | 2014-08-26 |
| 8809190 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-08-19 |
| 8796828 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2014-08-05 |
| 8796135 | Microelectronic elements with rear contacts connected with via first or via middle structures | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-08-05 |
| 8791575 | Microelectronic elements having metallic pads overlying vias | Vage Oganesian, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2014-07-29 |
| 8786070 | Microelectronic package with stacked microelectronic elements and method for manufacture thereof | Hiroaki Sato, Norihito Masuda, Belgacem Haba | 2014-07-22 |
| 8742541 | High density three-dimensional integrated capacitors | Belgacem Haba, Cyprian Emeka Uzoh, Piyush Savalia, Vage Oganesian | 2014-06-03 |
| 8736066 | Stacked microelectronic assemby with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-05-27 |
| 8728934 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Vage Oganesian | 2014-05-20 |
| 8728865 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ellis Chau | 2014-05-20 |
| 8723327 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Terrence Caskey | 2014-05-13 |
| 8723049 | Low-stress TSV design using conductive particles | Charles G. Woychik, Kishor Desai, Terrence Caskey | 2014-05-13 |
| 8709933 | Interposer having molded low CTE dielectric | Belgacem Haba | 2014-04-29 |
| 8709913 | Simultaneous wafer bonding and interconnect joining | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2014-04-29 |