Issued Patents All Time
Showing 251–275 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8476774 | Off-chip VIAS in stacked chips | Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2013-07-02 |
| 8387531 | Impact sensing switch | Kenneth Honer, Rolfe Tyson Gustus | 2013-03-05 |
| 8338963 | Multiple die face-down stacking for two or more die | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp | 2012-12-25 |
| 8329581 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan +1 more | 2012-12-11 |
| 8299626 | Microelectronic package | Belgacem Haba, Sean Moran, Wei-Shun Wang, Ellis Chau, Christopher Wade | 2012-10-30 |
| 8294284 | Package stacking through rotation | — | 2012-10-23 |
| 8155663 | Wearable ultra-thin miniaturized mobile communications | Stuart E. Wilson, Charles White, Hari Chakravarthula | 2012-04-10 |
| 8093697 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ellis Chau | 2012-01-10 |
| 8076788 | Off-chip vias in stacked chips | Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2011-12-13 |
| 8058101 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ellis Chau | 2011-11-15 |
| 8043895 | Method of fabricating stacked assembly including plurality of stacked microelectronic elements | Belgacem Haba | 2011-10-25 |
| 8026611 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Belgacem Haba | 2011-09-27 |
| 7999397 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan +1 more | 2011-08-16 |
| 7994622 | Microelectronic packages having cavities for receiving microelectric elements | Belgacem Haba, Wael Zohni, Philip R. Osborn | 2011-08-09 |
| 7994644 | Package stacking through rotation | — | 2011-08-09 |
| 7964947 | Stacking packages with alignment elements | Chung-Chuan Tseng | 2011-06-21 |
| 7901989 | Reconstituted wafer level stacking | Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2011-03-08 |
| 7745943 | Microelectonic packages and methods therefor | Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan +1 more | 2010-06-29 |
| 7683468 | Enabling uniformity of stacking process through bumpers | Belgacem Haba | 2010-03-23 |
| 7605479 | Stacked chip assembly with encapsulant layer | — | 2009-10-20 |
| 7554206 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Ronald Green, Stuart E. Wilson, Wael Zohni +2 more | 2009-06-30 |
| 7534652 | Microelectronic elements with compliant terminal mountings and methods for making the same | Belgacem Haba, Craig Mitchell, Michael Warner, Jesse Thompson | 2009-05-19 |
| 7453157 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan +1 more | 2008-11-18 |
| 7335995 | Microelectronic assembly having array including passive elements and interconnects | L. Pflughaupt, David Gibson, Young Gon Kim, Craig Mitchell, Wael Zohni | 2008-02-26 |
| 7208820 | Substrate having a plurality of I/O routing arrangements for a microelectronic device | — | 2007-04-24 |