Issued Patents All Time
Showing 226–250 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8697492 | No flow underfill | Belgacem Haba, Ellis Chau, Sang Il Lee, Kishor Desai | 2014-04-15 |
| 8698323 | Microelectronic assembly tolerant to misplacement of microelectronic elements therein | Belgacem Haba | 2014-04-15 |
| 8697569 | Non-lithographic formation of three-dimensional conductive elements | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-04-15 |
| 8686565 | Stacked chip assembly having vertical vias | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-04-01 |
| 8685793 | Chip assembly having via interconnects joined by plating | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2014-04-01 |
| 8680662 | Wafer level edge stacking | Belgacem Haba, Laura Wills Mirkarimi, Moshe Kriman | 2014-03-25 |
| 8664681 | Parallel plate slot emission array | Liang Wang, Steven Dean Gottke | 2014-03-04 |
| 8652935 | Void-free wafer bonding using channels | Piyush Savalia, Craig Mitchell, Vage Oganesian, Belgacem Haba | 2014-02-18 |
| 8637992 | Flip chip package for DRAM with two underfill materials | Kazuo Sakuma, Philip Damberg | 2014-01-28 |
| 8637968 | Stacked microelectronic assembly having interposer connecting active chips | Belgacem Haba, Vage Oganesian, Piyush Savalia, Craig Mitchell | 2014-01-28 |
| 8630658 | Wearable ultra-thin miniaturized mobile communications | Stuart E. Wilson, Charles White, Hari Chakravarthula | 2014-01-14 |
| 8624348 | Chips with high fracture toughness through a metal ring | — | 2014-01-07 |
| 8618659 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2013-12-31 |
| 8610259 | Multi-function and shielded 3D interconnects | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2013-12-17 |
| 8610264 | Compliant interconnects in wafers | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2013-12-17 |
| 8598695 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Craig Mitchell, Belgacem Haba, Piyush Savalia | 2013-12-03 |
| 8587126 | Stacked microelectronic assembly with TSVs formed in stages with plural active chips | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2013-11-19 |
| 8541873 | Microelectronic packages having cavities for receiving microelectronic elements | Belgacem Haba, Wael Zohni, Philip R. Osborn | 2013-09-24 |
| 8525338 | Chip with sintered connections to package | Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda, Belgacem Haba +1 more | 2013-09-03 |
| 8512491 | Dual wafer spin coating | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2013-08-20 |
| 8513794 | Stacked assembly including plurality of stacked microelectronic elements | Belgacem Haba | 2013-08-20 |
| 8513817 | Memory module in a package | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp | 2013-08-20 |
| 8502340 | High density three-dimensional integrated capacitors | Vage Oganesian, Belgacem Haba, Piyush Savalia | 2013-08-06 |
| 8486758 | Simultaneous wafer bonding and interconnect joining | Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2013-07-16 |
| 8487421 | Microelectronic package with stacked microelectronic elements and method for manufacture thereof | Hiroaki Sato, Norihito Masuda, Belgacem Haba | 2013-07-16 |