Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830845 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2023-11-28 |
| 11424211 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2022-08-23 |
| 10833044 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-11-10 |
| 10593643 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2020-03-17 |
| D846809 | Helmet | Sosuke Shimano, Kunikazu Sakura | 2019-04-23 |
| 10062661 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2018-08-28 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2017-06-27 |
| 9666450 | Substrate and assembly thereof with dielectric removal for increased post height | Philip Damberg, Belgacem Haba | 2017-05-30 |
| 9318460 | Substrate and assembly thereof with dielectric removal for increased post height | Philip Damberg, Belgacem Haba | 2016-04-19 |
| 9224717 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-12-29 |
| 9093435 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2015-07-28 |
| 8951845 | Methods of fabricating a flip chip package for dram with two underfill materials | Ilyas Mohammed, Philip Damberg | 2015-02-10 |
| 8884432 | Substrate and assembly thereof with dielectric removal for increased post height | Philip Damberg, Belgacem Haba | 2014-11-11 |
| 8637992 | Flip chip package for DRAM with two underfill materials | Ilyas Mohammed, Philip Damberg | 2014-01-28 |
| 8618659 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2013-12-31 |
| 4529540 | Humidity-sensitive resistive element | Shigeki Uno, Mituo Harata, Hideaki Hiraki | 1985-07-16 |
| 4509035 | Humidity-sensitive element and process for producing the same | Mituo Harata, Hideaki Hiraki, Shigeki Uno, Kiyosi Matsunaga | 1985-04-02 |