Issued Patents All Time
Showing 101–125 of 278 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847277 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2017-12-19 |
| 9842745 | Heat spreading substrate with embedded interconnects | Masud Beroz | 2017-12-12 |
| 9832887 | Micro mechanical anchor for 3D architecture | Liang Wang, Belgacem Haba | 2017-11-28 |
| 9812433 | Batch process fabrication of package-on-package microelectronic assemblies | Belgacem Haba, Liang Wang | 2017-11-07 |
| 9812360 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Vage Oganesian | 2017-11-07 |
| 9761517 | Porous alumina templates for electronic packages | Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2017-09-12 |
| 9716075 | Semiconductor chip assembly and method for making same | Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more | 2017-07-25 |
| 9691731 | Package-on-package assembly with wire bonds to encapsulation surface | Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more | 2017-06-27 |
| 9685365 | Method of forming a wire bond having a free end | — | 2017-06-20 |
| 9659858 | Low-stress vias | Belgacem Haba, Cyprian Emeka Uzoh | 2017-05-23 |
| 9659812 | Microelectronic elements with post-assembly planarization | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2017-05-23 |
| 9640437 | Methods of forming semiconductor elements using micro-abrasive particle stream | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2017-05-02 |
| 9633979 | Microelectronic assemblies having stack terminals coupled by connectors extending through encapsulation | Belgacem Haba | 2017-04-25 |
| 9633968 | Microelectronic packages having cavities for receiving microelectronic elements | Belgacem Haba, Wael Zohni, Philip R. Osborn | 2017-04-25 |
| 9627366 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Belgacem Haba | 2017-04-18 |
| 9620437 | Stacked microelectronic assembly with TSVS formed in stages and carrier above chip | Vage Oganesian, Belgacem Haba, Craig Mitchell, Piyush Savalia | 2017-04-11 |
| 9615451 | Porous alumina templates for electronic packages | Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2017-04-04 |
| 9615456 | Microelectronic assembly for microelectronic packaging with bond elements to encapsulation surface | Belgacem Haba, Terrence Caskey, Reynaldo Co, Ellis Chau | 2017-04-04 |
| 9583671 | Quantum efficiency of multiple quantum wells | Liang Wang, Masud Beroz | 2017-02-28 |
| 9583475 | Microelectronic package with stacked microelectronic units and method for manufacture thereof | Terrence Caskey | 2017-02-28 |
| 9558998 | Systems and methods for producing flat surfaces in interconnect structures | Cyprian Emeka Uzoh, Vage Oganesian | 2017-01-31 |
| 9560773 | Electrical barrier layers | Cyprian Emeka Uzoh, Vage Oganesian, Belgacem Haba, Piyush Savalia, Craig Mitchell | 2017-01-31 |
| 9559061 | Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof | Belgacem Haba | 2017-01-31 |
| 9508629 | Memory module in a package | Belgacem Haba, Wael Zohni, Richard Dewitt Crisp | 2016-11-29 |
| 9502390 | BVA interposer | Terrence Caskey, Cyprian Emeka Uzoh, Charles G. Woychik, Michael Newman, Pezhman Monadgemi +3 more | 2016-11-22 |