Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Directly bonded structures without intervening adhesive and methods for forming the same

Directly bonded structures without intervening adhesive and methods for forming the same

US Patent 11817409 · Granted Nov 14, 2023

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated cooling assembly with upper and lower channels2025
Embedded organic interposer for high bandwidth2025
Embedded organic interposer for high bandwidth2025
Package-on-package assembly with wire bonds to encapsulation surface2025
Package-on-package assembly with wire bonds to encapsulation surface2025
Compressive sensing based image processing2025
Metal pads over TSV2025
Metal pads over TSV2025
3D NAND-high aspect ratio strings and channels2025
3D NAND-high aspect ratio strings and channels2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Bonded structure including an obstructive element directly bonded to a semicondu2025