Issued Patents All Time
Showing 26–50 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865548 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Arkalgud R. Sitaram | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Scott McGrath, Hong Shen +2 more | 2018-01-02 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-11-21 |
| 9812406 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Rajesh Katkar, Guilian Gao | 2017-11-07 |
| 9780042 | Tunable composite interposer | Cyprian Emeka Uzoh, Hiroaki Sato | 2017-10-03 |
| 9769923 | Interposers | Bong-Sub Lee, Cyprian Emeka Uzoh, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-09-19 |
| 9741649 | Integrated interposer solutions for 2D and 3D IC packaging | Hong Shen, Arkalgud R. Sitaram, Guilian Gao | 2017-08-22 |
| 9735084 | Bond via array for thermal conductivity | Rajesh Katkar, Guilian Gao, Wael Zohni | 2017-08-15 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2017-06-27 |
| 9685401 | Structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2017-06-20 |
| 9673124 | Device and method for localized underfill | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2017-06-06 |
| 9610758 | Method of making demountable interconnect structure | Raymond Albert Fillion | 2017-04-04 |
| 9601398 | Thin wafer handling and known good die test method | Se Young Yang, Pezhman Monadgemi, Terrence Caskey, Cyprian Emeka Uzoh | 2017-03-21 |
| 9570385 | Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks | Bong-Sub Lee, Cyprian Emeka Uzoh, Liang Wang, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2017-02-14 |
| 9558964 | Method of fabricating low CTE interposer without TSV structure | Cyprian Emeka Uzoh, Michael Newman, Terrence Caskey | 2017-01-31 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Hong Shen, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-01-17 |
| 9536862 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Hong Shen, Arkalgud R. Sitaram | 2017-01-03 |
| 9524883 | Holding of interposers and other microelectronic workpieces in position during assembly and other processing | Eric Tosaya, Rajesh Katkar | 2016-12-20 |
| 9508687 | Low cost hybrid high density package | Kishor Desai, Qwai H. Low, Chok J. Chia, Huailiang Wei | 2016-11-29 |
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Michael Newman, Pezhman Monadgemi +3 more | 2016-11-22 |
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Hong Shen, Liang Wang, Rajesh Katkar, Guilian Gao | 2016-10-25 |
| 9433100 | Low-stress TSV design using conductive particles | Kishor Desai, Ilyas Mohammed, Terrence Caskey | 2016-08-30 |
| 9418924 | Stacked die integrated circuit | Cyprian Emeka Uzoh, Ron Zhang, Daniel Buckminster, Guilian Gao | 2016-08-16 |
| 9402312 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Zhuowen Sun, Arkalgud R. Sitaram | 2016-07-26 |
| 9398700 | Method of forming a reliable microelectronic assembly | Cyprian Emeka Uzoh, Belgacem Haba, Michael Newman, Terrence Caskey | 2016-07-19 |