Issued Patents All Time
Showing 51–75 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Arkalgud R. Sitaram, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2016-07-19 |
| 9379008 | Metal PVD-free conducting structures | Cyprian Emeka Uzoh, Michael Newman, Pezhman Monadgemi, Terrence Caskey | 2016-06-28 |
| 9373585 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Arkalgud R. Sitaram | 2016-06-21 |
| 9362204 | Tunable composite interposer | Cyprian Emeka Uzoh, Hiroaki Sato | 2016-06-07 |
| 9355905 | Methods and structure for carrier-less thin wafer handling | Cyprian Emeka Uzoh, Pezhman Monadgemi, Michael Newman, Terrence Caskey | 2016-05-31 |
| 9355997 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Laura Wills Mirkarimi, Arkalgud R. Sitaram | 2016-05-31 |
| 9349614 | Device and method for localized underfill | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2016-05-24 |
| 9349669 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2016-05-24 |
| 9252127 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Hong Shen, Arkalgud R. Sitaram | 2016-02-02 |
| 9237648 | Carrier-less silicon interposer | Michael Newman, Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey | 2016-01-12 |
| 9123780 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2015-09-01 |
| 9064933 | Methods and structure for carrier-less thin wafer handling | Cyprian Emeka Uzoh, Pezhman Monadgemi, Michael Newman, Terrence Caskey | 2015-06-23 |
| 9000600 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2015-04-07 |
| 8981564 | Metal PVD-free conducting structures | Cyprian Emeka Uzoh, Michael Newman, Pezhman Monadgemi, Terrence Caskey | 2015-03-17 |
| 8963310 | Low cost hybrid high density package | Kishor Desai, Qwai H. Low, Chok J. Chia, Huailiang Wei | 2015-02-24 |
| 8963335 | Tunable composite interposer | Cyprian Emeka Uzoh, Hiroaki Sato | 2015-02-24 |
| 8929071 | Low cost manufacturing of micro-channel heatsink | Richard Alfred Beaupre, Ljubisa Dragoljub Stevanovic, Daniel Jason Erno | 2015-01-06 |
| 8884427 | Low CTE interposer without TSV structure | Cyprian Emeka Uzoh, Michael Newman, Terrence Caskey | 2014-11-11 |
| 8846447 | Thin wafer handling and known good die test method | Se Young Yang, Pezhman Monadgemi, Terrence Caskey, Cyprian Emeka Uzoh | 2014-09-30 |
| 8785790 | High strength through-substrate vias | Cyprian Emeka Uzoh, Terrence Caskey, Belgacem Haba, Hiroaki Sato, Philip Damberg | 2014-07-22 |
| 8772946 | Reduced stress TSV and interposer structures | Cyprian Emeka Uzoh, Terrence Caskey, Kishor Desai, Huailiang Wei, Craig Mitchell +1 more | 2014-07-08 |
| 8723049 | Low-stress TSV design using conductive particles | Kishor Desai, Ilyas Mohammed, Terrence Caskey | 2014-05-13 |
| 8659148 | Tileable sensor array | John Eric Tkaczyk, Lowell Scott Smith, Charles Edward Baumgartner, Robert Gideon Wodnicki, Rayette Ann Fisher +1 more | 2014-02-25 |
| 8575558 | Detector array with a through-via interposer | John Eric Tkaczyk, James Wilson Rose, Jonathan David Short | 2013-11-05 |
| 8525312 | Area array quad flat no-lead (QFN) package | Qwai H. Low, Chok J. Chia, Kishor Desai, Huailiang Wei | 2013-09-03 |