Issued Patents All Time
Showing 51–75 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6452116 | Use of blind vias for soldered interconnections between substrates and printed wiring boards | Gregg J. Armezzani, Jeffrey S. Perkins, John J. Pessarchick | 2002-09-17 |
| 6431432 | Method for attaching solderballs by selectively oxidizing traces | John McCormick | 2002-08-13 |
| 6433565 | Test fixture for flip chip ball grid array circuits | Maniam Alagaratnam, Sunil A. Patel | 2002-08-13 |
| 6335491 | Interposer for semiconductor package assembly | Maniam Alagaratnam, Sunil A. Patel | 2002-01-01 |
| 6306751 | Apparatus and method for improving ball joints in semiconductor packages | Sunil A. Patel, Chok J. Chia | 2001-10-23 |
| 6281581 | Substrate structure for improving attachment reliability of semiconductor chips and modules | Amit K. Sarkhel | 2001-08-28 |
| 6272742 | Method of electrically connecting substrates using solder balls | Gregg J. Armezzani, Jeffery S. Perkins, John J. Pessarchick | 2001-08-14 |
| 6266249 | Semiconductor flip chip ball grid array package | Sunil A. Patel, Ramaswamy Ranganathan | 2001-07-24 |
| 6251766 | Method for improving attachment reliability of semiconductor chips and modules | Amit K. Sarkhel | 2001-06-26 |
| 6224396 | Compliant, surface-mountable interposer | Benson Chan, John H. Sherman | 2001-05-01 |
| 6166434 | Die clip assembly for semiconductor package | Sunil A. Patel, John McCormick | 2000-12-26 |
| 6133064 | Flip chip ball grid array package with laminated substrate | Kumar Nagarajan | 2000-10-17 |
| 6023029 | Use of blind vias for soldered interconnections between substrates and printed wiring boards | Gregg J. Armezzani, Jeffery S. Perkins, John J. Pessarchick | 2000-02-08 |
| 6002171 | Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package | Sunil A. Patel, John McCormick | 1999-12-14 |
| 6002172 | Substrate structure and method for improving attachment reliability of semiconductor chips and modules | Amit K. Sarkhel | 1999-12-14 |
| 5884397 | Method for fabricating chip carriers and printed circuit boards | Gregg J. Armezzani, Jeffrey S. Perkins, John J. Pessarchick | 1999-03-23 |
| 5880590 | Apparatus and method for burn-in and testing of devices with solder bumps or preforms | Joseph Hromek | 1999-03-09 |
| 5604445 | Apparatus, and corresponding method, for stress testing semiconductor chips | Maganlal S. Patel, Sanjeev Sathe | 1997-02-18 |
| 5497103 | Test apparatus for circuitized substrate | William S. Ebert, David E. Engle, Thomas G. Macek | 1996-03-05 |
| 5479703 | Method of making a printed circuit board or card | Harold Kohn, Richard C. Senger, Donald P. Seraphim | 1996-01-02 |
| 5435480 | Method for filling plated through holes | Paul Joseph Hart, Edward Vytlacil, Ajit K. Trivedi | 1995-07-25 |
| 5259781 | Electrical connector alignment and actuation assembly | John G. Baumberger, James R. Bentlage, Fletcher W. Chapin, Alan D. Knight, Thomas G. Macek | 1993-11-09 |
| 5201451 | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate | Nelson P. Franchak, Robert H. Katyl, Harold Kohn | 1993-04-13 |
| 5199879 | Electrical assembly with flexible circuit | Harold Kohn, Ronald J. Romanosky, George J. Saxenmeyer, Jr., Reinhold E. Tomek, James R. Webb | 1993-04-06 |
| 5170931 | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate | Nelson P. Franchak, Robert H. Katyl, Harold Kohn, Tamar A. Sholtes, Vilakkudi G. Veeraraghavan +1 more | 1992-12-15 |