Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5811736 | Electronic circuit cards with solder-filled blind vias | John M. Lauffer | 1998-09-22 |
| 5479703 | Method of making a printed circuit board or card | Kishor Desai, Harold Kohn, Donald P. Seraphim | 1996-01-02 |
| 5316788 | Applying solder to high density substrates | Eric P. Dibble, Steven L. Hanakovic, Voya R. Markovich, Daniel S. Niedrich, Gary Paul Vlasak +1 more | 1994-05-31 |