| 11886013 |
Passively-aligned fiber array to waveguide configuration |
Kalpendu Shastri, Anujit Shastri, Soham Pathak, Alan Leonhartsberger, Rutvij Dave +1 more |
2024-01-30 |
| 11611738 |
User interface module for converting a standard 2D display device into an interactive 3D display device |
Soham Pathak, Ankita Shastri, Kalpendu Shastri |
2023-03-21 |
| 10725254 |
High density opto-electronic interconnection configuration utilizing passive alignment |
Kalpendu Shastri, Anujit Shastri, Soham Pathak, Alan Leonhartsberger, Rao Yelamarty |
2020-07-28 |
| 10209464 |
Direct printed circuit routing to stacked opto-electrical IC packages |
Stefan Pfnuer, Matthew J. Traverso |
2019-02-19 |
| 9793902 |
Reference-less clock and data recovery circuit |
Kadaba Lakshmikumar, Mark Y. Tse, Bibhu Prasad Das |
2017-10-17 |
| 9575266 |
Molded glass lid for wafer level packaging of opto-electronic assemblies |
Kishor Desai, Ravinder Kachru, Vipulkumar Patel, Kalpendu Shastri, Soham Pathak |
2017-02-21 |
| 9435965 |
Single mode fiber array connector for opto-electronic transceivers |
Chris Togami, Soham Pathak, Kalpendu Shastri, Vipulkumar Patel, Ravinder Kachru +1 more |
2016-09-06 |
| 9343450 |
Wafer scale packaging platform for transceivers |
Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster, Prakash Gothoskar, Ravinder Kachru +5 more |
2016-05-17 |
| 9235019 |
Self-aligning optical connector assembly |
Kalpendu Shastri, Soham Pathak, Utpal Kumar Chakrabarti, Vipulkumar Patel, Ravinder Kachru +1 more |
2016-01-12 |
| 9209509 |
Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits |
Kalpendu Shastri, Mark A. Webster, David Piede |
2015-12-08 |
| 9052445 |
Molded glass lid for wafer level packaging of opto-electronic assemblies |
Kishor Desai, Ravinder Kachru, Vipulkumar Patel, Kalpendu Shastri, Soham Pathak |
2015-06-09 |
| 9031107 |
Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components |
Kalpendu Shastri, Soham Pathak, Vipulkumar Patel, Kishor Desai |
2015-05-12 |
| 8929689 |
Optical modulator utilizing unary encoding and auxiliary modulator section for load balancing |
Peter C. Metz, Kalpendu Shastri |
2015-01-06 |
| 8905632 |
Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components |
Kalpendu Shastri, Soham Pathak, Vipulkumar Patel, Kishor Desai |
2014-12-09 |
| 8876410 |
Self-aligning connectorized fiber array assembly |
Kalpendu Shastri, Soham Pathak, Utpal Kumar Chakrabarti, Vipulkumar Patel, Ravinder Kachru +1 more |
2014-11-04 |
| 8803269 |
Wafer scale packaging platform for transceivers |
Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster, Prakash Gothoskar, Ravinder Kachru +5 more |
2014-08-12 |
| 8724939 |
Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits |
Kalpendu Shastri, Mark A. Webster, David Piede |
2014-05-13 |
| 8364042 |
Optical interconnection arrangement for high speed, high density communication systems |
Kalpendu Shastri, Mark A. Webster |
2013-01-29 |
| 8340529 |
HDMI TMDS optical signal transmission using PAM technique |
Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster |
2012-12-25 |
| 7570889 |
Common electronic dispersion compensation arrangement for use with multiple optical communication channels |
Kalpendu Shastri, David Piede |
2009-08-04 |
| 7483597 |
Optical modulator utilizing multi-level signaling |
Kalpendu Shastri |
2009-01-27 |
| 7269809 |
Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits |
Kalpendu Shastri, Soham Pathak, Prakash Gothoskar, Paulius Mosinskis |
2007-09-11 |