Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11886013 | Passively-aligned fiber array to waveguide configuration | Kalpendu Shastri, Anujit Shastri, Soham Pathak, Alan Leonhartsberger, Rutvij Dave +1 more | 2024-01-30 |
| 11611738 | User interface module for converting a standard 2D display device into an interactive 3D display device | Soham Pathak, Ankita Shastri, Kalpendu Shastri | 2023-03-21 |
| 10725254 | High density opto-electronic interconnection configuration utilizing passive alignment | Kalpendu Shastri, Anujit Shastri, Soham Pathak, Alan Leonhartsberger, Rao Yelamarty | 2020-07-28 |
| 10209464 | Direct printed circuit routing to stacked opto-electrical IC packages | Stefan Pfnuer, Matthew J. Traverso | 2019-02-19 |
| 9793902 | Reference-less clock and data recovery circuit | Kadaba Lakshmikumar, Mark Y. Tse, Bibhu Prasad Das | 2017-10-17 |
| 9575266 | Molded glass lid for wafer level packaging of opto-electronic assemblies | Kishor Desai, Ravinder Kachru, Vipulkumar Patel, Kalpendu Shastri, Soham Pathak | 2017-02-21 |
| 9435965 | Single mode fiber array connector for opto-electronic transceivers | Chris Togami, Soham Pathak, Kalpendu Shastri, Vipulkumar Patel, Ravinder Kachru +1 more | 2016-09-06 |
| 9343450 | Wafer scale packaging platform for transceivers | Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster, Prakash Gothoskar, Ravinder Kachru +5 more | 2016-05-17 |
| 9235019 | Self-aligning optical connector assembly | Kalpendu Shastri, Soham Pathak, Utpal Kumar Chakrabarti, Vipulkumar Patel, Ravinder Kachru +1 more | 2016-01-12 |
| 9209509 | Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits | Kalpendu Shastri, Mark A. Webster, David Piede | 2015-12-08 |
| 9052445 | Molded glass lid for wafer level packaging of opto-electronic assemblies | Kishor Desai, Ravinder Kachru, Vipulkumar Patel, Kalpendu Shastri, Soham Pathak | 2015-06-09 |
| 9031107 | Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components | Kalpendu Shastri, Soham Pathak, Vipulkumar Patel, Kishor Desai | 2015-05-12 |
| 8929689 | Optical modulator utilizing unary encoding and auxiliary modulator section for load balancing | Peter C. Metz, Kalpendu Shastri | 2015-01-06 |
| 8905632 | Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components | Kalpendu Shastri, Soham Pathak, Vipulkumar Patel, Kishor Desai | 2014-12-09 |
| 8876410 | Self-aligning connectorized fiber array assembly | Kalpendu Shastri, Soham Pathak, Utpal Kumar Chakrabarti, Vipulkumar Patel, Ravinder Kachru +1 more | 2014-11-04 |
| 8803269 | Wafer scale packaging platform for transceivers | Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster, Prakash Gothoskar, Ravinder Kachru +5 more | 2014-08-12 |
| 8724939 | Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits | Kalpendu Shastri, Mark A. Webster, David Piede | 2014-05-13 |
| 8364042 | Optical interconnection arrangement for high speed, high density communication systems | Kalpendu Shastri, Mark A. Webster | 2013-01-29 |
| 8340529 | HDMI TMDS optical signal transmission using PAM technique | Kalpendu Shastri, Vipulkumar Patel, Mark A. Webster | 2012-12-25 |
| 7570889 | Common electronic dispersion compensation arrangement for use with multiple optical communication channels | Kalpendu Shastri, David Piede | 2009-08-04 |
| 7483597 | Optical modulator utilizing multi-level signaling | Kalpendu Shastri | 2009-01-27 |
| 7269809 | Integrated approach for design, simulation and verification of monolithic, silicon-based opto-electronic circuits | Kalpendu Shastri, Soham Pathak, Prakash Gothoskar, Paulius Mosinskis | 2007-09-11 |