Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6743979 | Bonding pad isolation | Michael Berman, Aftab Ahmad, Chok J. Chia, Ramaswamy Ranganathan | 2004-06-01 |
| 6603200 | Integrated circuit package | Chok J. Chia, Seng-Sooi Lim | 2003-08-05 |
| 6573113 | Integrated circuit having dedicated probe pads for use in testing densely patterned bonding pads | William T. Bright, Ramaswamy Ranganathan | 2003-06-03 |
| 6489571 | Molded tape ball grid array package | Chok J. Chia, Patrick Variot | 2002-12-03 |
| 6486002 | Tape design to reduce warpage | Ramaswamy Ranganathan, Sengsooi Lim | 2002-11-26 |
| 6429534 | Interposer tape for semiconductor package | Chok J. Chia, Maniam Alagaratnam | 2002-08-06 |
| 6425179 | Method for assembling tape ball grid arrays | Chok J. Chia, Ramaswamy Ranganathan | 2002-07-30 |
| 6329278 | Multiple row wire bonding with ball bonds of outer bond pads bonded on the leads | Ramaswamy Ranganathan, Rey Torcuato | 2001-12-11 |
| 6285077 | Multiple layer tape ball grid array package | Chok J. Chia, Seng-Sooi Lim | 2001-09-04 |
| 6143586 | Electrostatic protected substrate | Chok J. Chia, Patrick Variot | 2000-11-07 |
| 6114189 | Molded array integrated circuit package | Chok J. Chia, Seng-Sooi Lim | 2000-09-05 |
| 6057594 | High power dissipating tape ball grid array package | Chok J. Chia, Maniam Alagaratnam | 2000-05-02 |
| 6040632 | Multiple sized die | Chok J. Chia, Seng-Sooi Lim | 2000-03-21 |
| 5973393 | Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits | Chok J. Chia, Seng-Sooi Lim | 1999-10-26 |
| 5973397 | Semiconductor device and fabrication method which advantageously combine wire bonding and tab techniques to increase integrated circuit I/O pad density | Chok J. Chia, Seng-Sooi Lim | 1999-10-26 |
| 5923047 | Semiconductor die having sacrificial bond pads for die test | Chok J. Chia, Maniam Alagaratnam | 1999-07-13 |
| 5886398 | Molded laminate package with integral mold gate | Manickam Thavarajah, Chok J. Chia, Maniam Alagaratnam | 1999-03-23 |
| 5841191 | Ball grid array package employing raised metal contact rings | Chok J. Chia, Maniam Alagaratnam | 1998-11-24 |
| 5814881 | Stacked integrated chip package and method of making same | Maniam Alagaratnam, Chok J. Chia | 1998-09-29 |
| 5568683 | Method of cooling a packaged electronic device | Chok J. Chia, Manian Alagaratnam, Seng-Sooi Lim | 1996-10-29 |
| 5463529 | High power dissipating packages with matched heatspreader heatsink assemblies | Chok J. Chia, Manian Alagaratnam, Seng-Sooi Lim | 1995-10-31 |
| 5386144 | Snap on heat sink attachment | Patrick Variot, Maniam Alagaratnam, Teresa Dalao | 1995-01-31 |
| 5353193 | High power dissipating packages with matched heatspreader heatsink assemblies | Chok J. Chia, Manian Alagaratnam, Seng-Sooi Lim | 1994-10-04 |