Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5568683 | Method of cooling a packaged electronic device | Chok J. Chia, Qwai H. Low, Seng-Sooi Lim | 1996-10-29 |
| 5463529 | High power dissipating packages with matched heatspreader heatsink assemblies | Chok J. Chia, Qwai H. Low, Seng-Sooi Lim | 1995-10-31 |
| 5353193 | High power dissipating packages with matched heatspreader heatsink assemblies | Chok J. Chia, Qwai H. Low, Seng-Sooi Lim | 1994-10-04 |