Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6441499 | Thin form factor flip chip ball grid array | Sarathy Rajagopalan | 2002-08-27 |
| 6320127 | Method and structure for reducing the incidence of voiding in an underfill layer of an electronic component package | Sarathy Rajagopalan | 2001-11-20 |
| 6133064 | Flip chip ball grid array package with laminated substrate | Kishor Desai | 2000-10-17 |