| 7670915 |
Contact liner in integrated circuit technology |
Errol Todd Ryan, Paul R. Besser, Simon S. Chan, Robert J. Chiu, Minh Van Ngo |
2010-03-02 |
| 7093209 |
Method and apparatus for packaging test integrated circuits |
— |
2006-08-15 |
| 6995564 |
Method and system for locating chip-level defects through emission imaging of a semiconductor device |
Boon Yong Ang, Mohammed Massoodi |
2006-02-07 |
| 6991946 |
Method and system for providing backside voltage contrast for silicon on insulator devices |
Mohammad Massodi, Caiwen Yuan |
2006-01-31 |
| 6941529 |
Method and system for using emission microscopy in physical verification of memory device architecture |
Shivananda Shetty, W. Eugen Hill |
2005-09-06 |
| 6866416 |
Detecting heat generating failures in unpassivated semiconductor devices |
Alice H. Choi, Mohammad Massoodi, Boon Yong Ang |
2005-03-15 |
| 6830941 |
Method and apparatus for identifying individual die during failure analysis |
Chern-Jiann Lee, Boon Yong Ang, David Lin |
2004-12-14 |
| 6770495 |
Method for revealing active regions in a SOI structure for DUT backside inspection |
Boon Yong Ang |
2004-08-03 |
| 6770512 |
Method and system for using TMAH for staining copper silicon on insulator semiconductor device cross sections |
Mohammad Masoodi, Bryan Tracy |
2004-08-03 |
| 6528332 |
Method and system for reducing polymer build up during plasma etch of an intermetal dielectric |
Mohammad Massoodi, Jose Hulog |
2003-03-04 |
| 6485361 |
Apparatus for holding and delayering a semiconductor die |
— |
2002-11-26 |
| 6452234 |
How to improve the ESD on SOI devices |
— |
2002-09-17 |
| 6395129 |
Process to decapsulate a FBGA package |
Joseph Vu |
2002-05-28 |
| 6387206 |
Method and system for plastic package decapsulation of electronic devices |
Ahmad Ghaemmaghami |
2002-05-14 |
| 6320400 |
Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a short |
J. Courtney Black, Richard C. Blish, II, Mohammad Massoodi, S. Sidharth |
2001-11-20 |
| 6309899 |
Method and system for removing a die from a semiconductor package |
Jose Hulog |
2001-10-30 |
| 6304792 |
Separation of a multi-layer integrated circuit device and package |
— |
2001-10-16 |
| 6253353 |
Method and system for providing a library for identifying VCC to ground shorts in a circuit in a semiconductor device |
Jose Hulog |
2001-06-26 |
| 6227941 |
Support structure with multi-layer support material for use during package removal from a multi-layer integrated circuit device |
— |
2001-05-08 |
| 6181153 |
Method and system for detecting faults in a flip-chip package |
— |
2001-01-30 |
| 6127194 |
Package removal for FBGA devices |
Mohammad Massoodi |
2000-10-03 |
| 6076686 |
Support structure for use during package removal from a multi-layer integrated circuit device |
S. Sidharth |
2000-06-20 |
| 6030282 |
Method and apparatus for holding, grinding and polishing a packaged semiconductor die |
— |
2000-02-29 |