Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7192836 | Method and system for providing halo implant to a semiconductor device with minimal impact to the junction capacitance | Zoran Krivokapic, Brian Swanson | 2007-03-20 |
| 6387206 | Method and system for plastic package decapsulation of electronic devices | Mehrdad Mahanpour | 2002-05-14 |
| 6159755 | Method and system for detecting faults in a flip-chip package | Fred Khosropour, Mehdad Mahanpour | 2000-12-12 |
| 5904489 | Topside analysis of a multi-layer integrated circuit die mounted in a flip-chip package | Fred Khosropour | 1999-05-18 |