Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10673691 | User interaction platform | Maryam Najafi, Joseph L. Acayan | 2020-06-02 | |
| 6162651 | Method and system for accurately marking the backside of the die for fault location isolation | — | 2000-12-19 | $3,857,000 |
| 6159755 | Method and system for detecting faults in a flip-chip package | Mehdad Mahanpour, Ahmad Ghaemmaghami | 2000-12-12 | $4,351,000 |
| 5904489 | Topside analysis of a multi-layer integrated circuit die mounted in a flip-chip package | Ahmad Ghaemmaghami | 1999-05-18 | $2,666,000 |