Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for accurately marking the backside of the die for fault location isolation

Method and system for accurately marking the backside of the die for fault location isolation

US Patent 6162651 · Granted Dec 19, 2000

Estimated economic value: $3,857,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

User interaction platform2020
Method and system for detecting faults in a flip-chip package2000
Topside analysis of a multi-layer integrated circuit die mounted in a flip-chip 1999