Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147664 | Dynamic mounting thermal management for devices on board | Suresh Ramalingam, Daniel Elftmann, Brian D. Philofsky, Anthony Torza | 2018-12-04 |
| 10096502 | Method and apparatus for assembling and testing a multi-integrated circuit package | Suresh Ramalingam, Mohsen H. Mardi, Tien-Yu Lee, Ivor G. Barber, Cheang-Whang Chang +1 more | 2018-10-09 |
| 10085363 | Integrated compact impingement on extended heat surface | Hendrik Pieter Jacobus de Bock, Yogen Vishwas Utturkar, Matthew A. Ferguson, Bryan Patrick Whalen, Christian M. Giovanniello | 2018-09-25 |
| 10054575 | Hydrogen detector and hydrogen detection method | David Peter Robinson | 2018-08-21 |
| 10043730 | Stacked silicon package assembly having an enhanced lid | Tien-Yu Lee, Ferdinand F. Fernandez, Suresh Ramalingam, Ivor G. Barber, Inderjit Singh +1 more | 2018-08-07 |
| 9951767 | Vibrational fluid mover active controller | John Anthony Vogel, Christian M. Giovanniello | 2018-04-24 |
| 9947560 | Integrated circuit package, and methods and tools for fabricating the same | Mohsen H. Mardi, David Tan | 2018-04-17 |
| 9879661 | Vibrational fluid mover jet with active damping mechanism | John Anthony Vogel, Christian M. Giovanniello | 2018-01-30 |
| 9812374 | Thermal management device with textured surface for extended cooling limit | Suresh Ramalingam, Brian D. Philofsky | 2017-11-07 |
| 9793191 | Heat spreader with flexible tolerance mechanism | — | 2017-10-17 |
| 9668334 | Thermal clamp apparatus for electronic systems | Hendrik Pieter Jacobus de Bock, Yogen Vishwas Utturkar, Christian M. Giovanniello | 2017-05-30 |
| 9627281 | Semiconductor chip with thermal interface tape | Seth Prejean, Dales Morrison Kent, Ronnie Brandon, Michael Z. Su, Michael D. Bienek +2 more | 2017-04-18 |
| 9496199 | Heat spreader with flexible tolerance mechanism | — | 2016-11-15 |
| 9437561 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Michael Z. Su, Joe Siegel, Seth Prejean | 2016-09-06 |
| 9385055 | Stacked semiconductor chips with thermal management | Michael Z. Su, Bryan Black, Maxat Touzelbaev, Yizhang Yang | 2016-07-05 |
| 9263364 | Thermal interface material with support structure | Maxat Touzelbaev, Yizhang Yang, Bryan Black | 2016-02-16 |
| 9252138 | Interconnect devices for electronic packaging assemblies | David Mulford Shaddock, Arun Virupaksha Gowda, John Anthony Vogel, Christian M. Giovanniello | 2016-02-02 |
| 8868944 | Computing center power and cooling control apparatus and method | Stanley Ossias, Maxat Touzelbaev | 2014-10-21 |
| 8866276 | Semiconductor chip device with polymeric filler trench | Michael Z. Su, Bryan Black | 2014-10-21 |
| 8804331 | Portable computing device with thermal management | — | 2014-08-12 |
| 8796842 | Stacked semiconductor chip device with thermal management circuit board | Michael Z. Su, Bryan Black | 2014-08-05 |
| 8691626 | Semiconductor chip device with underfill | Michael Z. Su, Lei Fu, Bryan Black | 2014-04-08 |
| 8635044 | Transient thermal modeling of multisource power devices | Maxat Touzelbaev, Yizhang Yang | 2014-01-21 |
| 8617926 | Semiconductor chip device with polymeric filler trench | Michael Z. Su, Bryan Black | 2013-12-31 |
| 8574965 | Semiconductor chip device with liquid thermal interface material | Michael Z. Su, Bryan Black | 2013-11-05 |
