Issued Patents All Time
Showing 26–50 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11227842 | Electronic package and substrate structure having chamfers | Po-Hao Wang, Chun-Tang Lin, Bo-Hao Chang | 2022-01-18 |
| 11164755 | Electronic package and method for fabricating the same | Yung-Ta Li, Yi-Chian Liao, Kong-Toon Ng | 2021-11-02 |
| 11101566 | Method for fabricating electronic package | Han-Hung Chen, Chun-Yi Huang, Rung-Jeng Lin, Kuo-Hua Yu | 2021-08-24 |
| 11102890 | Electronic package and method for manufacturing the same | Ying-Chang Tseng, Yuan-Hung Hsu | 2021-08-24 |
| 11069661 | Electronic package | Wei-Jhen Chen, Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2021-07-20 |
| 11056470 | Electronic package and method for fabricating the same | Kong-Toon Ng, Hung-Ho Lee, Chee-Key Chung, Chi-Hsin Chiu | 2021-07-06 |
| 10950520 | Electronic package, method for fabricating the same, and heat dissipator | Yu-Lung Huang, Chee-Key Chung, Kuo-Hua Yu, Wen-Shan Tsai, En-Li Lin +2 more | 2021-03-16 |
| 10863626 | Electronic package carrier structure thereof, and method for fabricating the carrier structure | Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu | 2020-12-08 |
| 10763237 | Method for manufacturing electronic package | Yu-Min Lo, Chee-Key Chung, Kuo-Hua Yu, Hsiang-Hua Huang | 2020-09-01 |
| 10763223 | Substrate structure having chamfers | Po-Hao Wang, Chun-Tang Lin, Bo-Hao Chang | 2020-09-01 |
| 10756438 | Electronic package and method for fabricating the same | Han-Hung Chen, Chun-Yi Huang, Rung-Jeng Lin, Kuo-Hua Yu | 2020-08-25 |
| 10741500 | Electronic package | Chen-Yu Huang, Chee-Key Chung, Kong-Toon Ng, Rui-Feng Tai, Bo MA | 2020-08-11 |
| 10679932 | Semiconductor package and a substrate for packaging | Ho-Yi Tsai, Chin-Tsai Yao | 2020-06-09 |
| 10600708 | Electronic package and method for fabricating the same | Wen-Shan Tsai, Chee-Key Chung | 2020-03-24 |
| 10522500 | Method for manufacturing electronic package | Yu-Min Lo, Chee-Key Chung, Kuo-Hua Yu, Hsiang-Hua Huang | 2019-12-31 |
| 10522453 | Substrate structure with filling material formed in concave portion | Chin-Tsai Yao, Chun-Tang Lin, Fu-Tang Huang | 2019-12-31 |
| 10510720 | Electronic package and method for fabricating the same | Chin-Tsai Yao, Kuo-Hua Yu, Fu-Tang Huang | 2019-12-17 |
| 10361150 | Substrate construction and electronic package including the same | Chee-Key Chung, Yu-Min Lo, Han-Hung Chen, Fu-Tang Huang | 2019-07-23 |
| 10354891 | Electronic package and method for fabricating the same | Po-Hao Wang, Chih-Jen Yang, Yu-Chih Cheng, Chee-Key Chung | 2019-07-16 |
| 10062651 | Packaging substrate and electronic package having the same | Fang-Yu Liang, Hung-Hsien Chang, Yi-Che Lai | 2018-08-28 |
| 9900996 | Package substrate and structure | Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang | 2018-02-20 |
| 9842771 | Semiconductor device and fabrication method thereof and semiconductor structure | Chin-Tsai Yao, Hung-Ming Chang, Ming-Chin Chuang, Fu-Tang Huang | 2017-12-12 |
| 9666453 | Semiconductor package and a substrate for packaging | Ho-Yi Tsai, Chin-Tsai Yao | 2017-05-30 |
| 9607963 | Semiconductor device and fabrication method thereof | Chin-Tsai Yao, Ming-Chin Chuang, Fu-Tang Huang | 2017-03-28 |
| 9520351 | Packaging substrate and package structure | Chin-Tsai Yao, Ming-Chin Chuang, Ko-Cheng Liu, Fu-Tang Huang | 2016-12-13 |