Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9900996 | Package substrate and structure | Chang-Fu Lin, Chin-Tsai Yao, Ko-Cheng Liu, Fu-Tang Huang | 2018-02-20 |
| 9842771 | Semiconductor device and fabrication method thereof and semiconductor structure | Chang-Fu Lin, Chin-Tsai Yao, Hung-Ming Chang, Fu-Tang Huang | 2017-12-12 |
| 9607963 | Semiconductor device and fabrication method thereof | Chang-Fu Lin, Chin-Tsai Yao, Fu-Tang Huang | 2017-03-28 |
| 9520351 | Packaging substrate and package structure | Chang-Fu Lin, Chin-Tsai Yao, Ko-Cheng Liu, Fu-Tang Huang | 2016-12-13 |