Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414330 | Multi-gate device including semiconductor fin between dielectric fins and method of fabrication thereof | Chang-Miao Liu, Huiling Shang | 2025-09-09 |
| 12414331 | Isolation for multigate devices | Chang-Miao Liu, Ming-Lung Cheng | 2025-09-09 |
| 12324218 | Semiconductor devices with air gaps and the method thereof | Ming-Lung Cheng, Chang-Miao Liu | 2025-06-03 |
| 12278276 | Multi-channel devices and method with anti-punch through process | Chang-Miao Liu, Ming-Lung Cheng | 2025-04-15 |
| 12230720 | Semiconductor structure with recessed top semiconductor layer in substrate and method of fabricating the same | Wei-Lun Min, Chang-Miao Liu | 2025-02-18 |
| 12183806 | Semiconductor devices and methods of fabricating the same | Chang-Miao Liu | 2024-12-31 |
| 12166071 | Dielectric fins with air gap and backside self-aligned contact | Ming-Shuan Li, Ming-Lung Cheng, Chang-Miao Liu | 2024-12-10 |
| 11837631 | Source/drain spacer with air gap in semiconductor devices and methods of fabricating the same | Ming-Lung Cheng, Chang-Miao Liu | 2023-12-05 |
| 11688768 | Integrated circuit structure with source/drain spacers | Ming-Lung Cheng, Chang-Miao Liu | 2023-06-27 |
| 11600695 | Dielectric fins with air gap and backside self-aligned contact | Ming-Shuan Li, Ming-Lung Cheng, Chang-Miao Liu | 2023-03-07 |
| 9900996 | Package substrate and structure | Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Fu-Tang Huang | 2018-02-20 |
| 9520351 | Packaging substrate and package structure | Chang-Fu Lin, Chin-Tsai Yao, Ming-Chin Chuang, Fu-Tang Huang | 2016-12-13 |