Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368467 | Substrate structure and semiconductor package using the same | Ho-Yi Tsai, Chin-Tsai Yao | 2016-06-14 |
| 9013042 | Interconnection structure for semiconductor package | Ho-Yi Tsai, Chin-Tsai Yao, Jui-Chung Ho, Ching-Hui Hung | 2015-04-21 |
| 8895366 | Fabrication method of semiconductor package | Wen-Home Huang, Wen-Tsung Tseng, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2014-11-25 |
| 8698326 | Semiconductor package and fabrication method thereof | Wen-Home Huang, Wen-Tsung Tseng, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2014-04-15 |
| 8207973 | Systems and methods for control signal and data transmission between various types of electronic modules | Shu-Wen Teng, Cheng Chen, Wei Gu | 2012-06-26 |
| 8194146 | Apparatuses for capturing and storing real-time images | Shu-Wen Teng, Cheng Chen, Wei Gu, Ching-Chao Yang, Shih Tang Lin | 2012-06-05 |
| 7937520 | General purpose interface controller of resoure limited system | Shu-Wen Teng, Wei Gu, Cheng Chen | 2011-05-03 |
| 7863731 | Heat-dissipating structure and heat-dissipating semiconductor package having the same | Chin-Te Chen, Ke Yang | 2011-01-04 |
| 7596661 | Processing modules with multilevel cache architecture | Ting-Cheng Hsu, Yen-Yu Lin, Chih-Wei Ko | 2009-09-29 |
| 7299341 | Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems | — | 2007-11-20 |
| 7234041 | Embedded system with instruction prefetching device, and method for fetching instructions in embedded systems | — | 2007-06-19 |
| 7203072 | Heat dissipating structure and semiconductor package with the same | Chin-Te Chen | 2007-04-10 |
| 7196414 | Semiconductor package with heat sink | Han-Ping Pu, Cheng-Hsu Hsiao, Chien-Ping Huang | 2007-03-27 |
| 7177155 | Semiconductor package with heat sink | Han-Ping Pu, Cheng-Hsu Hsiao, Chien-Ping Huang | 2007-02-13 |
| 7102239 | Chip carrier for semiconductor chip | Han-Ping Pu, Chien-Ping Huang | 2006-09-05 |
| 7057276 | Semiconductor package with heat sink | Han-Ping Pu, Chien-Ping Huang | 2006-06-06 |
| 6980438 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Han-Ping Pu, Chin-Te Chen | 2005-12-27 |
| 6849942 | Semiconductor package with heat sink attached to substrate | Han-Ping Pu, Cheng-Hsu Hsiao, Chien-Ping Huang | 2005-02-01 |
| 6578097 | Method and apparatus for transmitting registered data onto a PCI bus | Chih-Jou Lin | 2003-06-10 |
| 6424189 | Apparatus and system for multi-stage event synchronization | Jen-Pin Su, Tsan-Hui Chen, Wen-Hsiang Lin, Chun-Chieh Wu | 2002-07-23 |