Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11216030 | Portable electronic device | Yan-Yu Chen, Ming-Cheng Tsou, Yu-Wen Cheng, Chun-Wen Wang, Wang-Hung Yeh | 2022-01-04 |
| 11145621 | Semiconductor package device and method of manufacturing the same | Jr-Wei LIN, Chia-Cheng Liu | 2021-10-12 |
| 10936020 | Electronic device and expansion device | Ching-Shiang Chang, Tung-Ying Wu, Wang-Hung Yeh, Po-Hsuan Wang, Ming-Cheng Tsou | 2021-03-02 |
| 9349705 | Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers | Mu-Hsuan Chan, Chun-Tang Lin, Yi-Che Lai | 2016-05-24 |
| 9269693 | Fabrication method of semiconductor package | Chun-Tang Lin, Yi-Che Lai | 2016-02-23 |
| 8952528 | Semiconductor package and fabrication method thereof | Chun-Tang Lin, Yi-Che Lai | 2015-02-10 |
| 8952537 | Conductive bump structure with a plurality of metal layers | Mu-Hsuan Chan, Chun-Tang Lin, Yi-Che Lai | 2015-02-10 |