Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9177859 | Semiconductor package having embedded semiconductor elements | Yan-Heng Chen, Yan-Yi Liao, Hung-Wen Liu, Chieh-Yuan Chi, Hsi-Chang Hsu | 2015-11-03 |
| 9147668 | Method for fabricating semiconductor structure | Chi-Tung Yeh | 2015-09-29 |
| 9087780 | Semiconductor package and method of fabricating the same | Wan-Ting Chen, Mu-Hsuan Chan, Yi-Chian Liao, Yi-Che Lai | 2015-07-21 |
| 8987012 | Method of testing a semiconductor package | Pin-Cheng Huang, Wen-Tsung Tseng, Yi-Che Lai | 2015-03-24 |
| 8952528 | Semiconductor package and fabrication method thereof | Chien-Feng Chan, Yi-Che Lai | 2015-02-10 |
| 8952537 | Conductive bump structure with a plurality of metal layers | Chien-Feng Chan, Mu-Hsuan Chan, Yi-Che Lai | 2015-02-10 |
| 8895367 | Fabrication method of semiconductor package | Jung-Pang Huang, Hui-Min Huang, Kuan-Wei Chuang, Yih-Jenn Jiang | 2014-11-25 |
| 8829687 | Semiconductor package and fabrication method thereof | Mu-Hsuan Chan, Wan-Ting Chen, Yi-Chian Liao, Yi-Chi Lai | 2014-09-09 |
| 8603911 | Semiconductor device and fabrication method thereof | Hui-Min Huang, Chien-Wei Lee, Yen-Ping Wang | 2013-12-10 |
| 8519526 | Semiconductor package and fabrication method thereof | Jung-Pang Huang, Hui-Min Huang, Kuan-Wei Chuang, Yih-Jenn Jiang | 2013-08-27 |