Issued Patents All Time
Showing 26–50 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7615862 | Heat dissipating package structure and method for fabricating the same | Chien-Ping Huang | 2009-11-10 |
| 7608915 | Heat dissipation semiconductor package | Chun-Ming Liao, Chien-Ping Huang, Ho-Yi Tsai | 2009-10-27 |
| 7564140 | Semiconductor package and substrate structure thereof | Wen-Hao Lee, Yu-Po Wang | 2009-07-21 |
| 7489044 | Semiconductor package and fabrication method thereof | Han-Ping Pu | 2009-02-10 |
| 7485496 | Semiconductor device package with a heat sink and method for fabricating the same | Kun-Sheng Chien, Shih-Kuang Chiu, Han-Ping Pu | 2009-02-03 |
| 7445957 | Method for fabricating wafer level semiconductor package with build-up layer | Chien-Ping Huang, Chih-Ming Huang | 2008-11-04 |
| 7364944 | Method for fabricating thermally enhanced semiconductor package | Chien-Ping Huang | 2008-04-29 |
| 7348211 | Method for fabricating semiconductor packages | Ying-Ren Lin, Ho-Yi Tsai, Chien-Ping Huang | 2008-03-25 |
| RE39957 | Method of making semiconductor package with heat spreader | Chien-Ping Huang, Tzong-Da Ho | 2007-12-25 |
| 7271483 | Bump structure of semiconductor package and method for fabricating the same | Ying-Ren Lin, Chien-Ping Huang, Ho-Yi Tsai | 2007-09-18 |
| 7205642 | Semiconductor package and method for fabricating the same | Yu-Po Wang, Chien-Ping Huang | 2007-04-17 |
| 7196414 | Semiconductor package with heat sink | Chang-Fu Lin, Han-Ping Pu, Chien-Ping Huang | 2007-03-27 |
| 7177155 | Semiconductor package with heat sink | Chang-Fu Lin, Han-Ping Pu, Chien-Ping Huang | 2007-02-13 |
| 7170152 | Wafer level semiconductor package with build-up layer and method for fabricating the same | Chien-Ping Huang, Chih-Ming Huang | 2007-01-30 |
| 7132312 | Method for fabricating semiconductor package having conductive bumps on chip | Chien-Ping Huang | 2006-11-07 |
| D529031 | IC card type circuit module | Chih-Ming Huang, Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan | 2006-09-26 |
| 7074645 | Fabrication method of semiconductor package with heat sink | Chien-Ping Huang, Tzong-Da Ho | 2006-07-11 |
| 7019406 | Thermally enhanced semiconductor package | Chien-Ping Huang | 2006-03-28 |
| 7005720 | Semiconductor package with photosensitive chip and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang | 2006-02-28 |
| 7002245 | Semiconductor package having conductive bumps on chip and method for fabricating the same | Chien-Ping Huang | 2006-02-21 |
| 6989296 | Fabrication method of semiconductor package with photosensitive chip | Chien-Ping Huang, Chih-Ming Huang | 2006-01-24 |
| 6963135 | Semiconductor package for memory chips | Cheng-Chian Chiang, Chih-Ming Huang, Chin-Huang Chang, Min-Nan Tsai | 2005-11-08 |
| 6919630 | Semiconductor package with heat spreader | — | 2005-07-19 |
| 6856015 | Semiconductor package with heat sink | Chien-Ping Huang, Shih-Kuang Chiu | 2005-02-15 |
| 6849942 | Semiconductor package with heat sink attached to substrate | Chang-Fu Lin, Han-Ping Pu, Chien-Ping Huang | 2005-02-01 |