Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8421199 | Semiconductor package structure | Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang | 2013-04-16 |
| 8390118 | Semiconductor package having electrical connecting structures and fabrication method thereof | Pang-Chun Lin, Chun-Yuan Li, Fu Tang, Chien-Ping Huang | 2013-03-05 |
| 8304268 | Fabrication method of semiconductor package structure | Pang-Chun Lin, Chun-Yuan Li, Chien-Ping Huang | 2012-11-06 |
| 8253248 | Fabrication method of semiconductor device having conductive bumps | Chien-Ping Huang | 2012-08-28 |
| 8198689 | Package structure having micro-electromechanical element and fabrication method thereof | Chang-Yueh Chan, Chien-Ping Huang, Chun-An Huang, Chih-Ming Huang | 2012-06-12 |
| 8154115 | Package structure having MEMS element and fabrication method thereof | Chang-Yueh Chan, Chien-Ping Huang, Shih-Kuang Chiu | 2012-04-10 |
| 8026602 | Fabrication method of semiconductor device having conductive bumps | Chien-Ping Huang | 2011-09-27 |
| 7934313 | Package structure fabrication method | Pang-Chun Lin, Hsiao-Jen Hung, Chun-Yuan Li, Chien-Ping Huang | 2011-05-03 |
| 7863740 | Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof | Chien-Ping Huang | 2011-01-04 |
| 7804173 | Semiconductor device having conductive bumps and deviated solder pad | Chien-Ping Huang | 2010-09-28 |
| 7666779 | Fabrication method of a semiconductor device | Kook-Jui Tai, Chien-Ping Huang | 2010-02-23 |
| 7358177 | Fabrication method of under bump metallurgy structure | Chien-Ping Huang | 2008-04-15 |
| 7355279 | Semiconductor device and fabrication method thereof | Kook-Jui Tai, Chien-Ping Huang | 2008-04-08 |
| 6864564 | Flash-preventing semiconductor package | Randy H. Y. Lo, ChiChuan Wu | 2005-03-08 |
| 6753609 | Circuit probing contact pad formed on a bond pad in a flip chip package | Feng-Lung Chien, Randy H. Y. Lo | 2004-06-22 |
| 6309914 | Method for making a semiconductor package | Chien-Ping Huang | 2001-10-30 |
| 6258705 | Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip | Feng-Lung Chien, Randy H. Y. Lo | 2001-07-10 |