Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8970053 | Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM | Sheng-Li Lu, Jih-Fu Wang, Hsien-Wen Chen, Kuan-Yu Yang | 2015-03-03 |