Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278173 | Electronic package and substrate structure thereof | Wen-Chen Hsieh, Ya-Ting Chi, Chia-Wen Tsao, Hsin-Yin Chang, Yi-Lin Tsai | 2025-04-15 |
| 12219693 | Carrier structure | Chin-Wei Hsu, Jui-Kun Wang, Shu-Yu Ko, Fang-Wei Chang | 2025-02-04 |
| 12154848 | Electronic package and manufacturing method thereof, and substrate structure | Chia-Wen Tsao, Wen-Chen Hsieh, Yi-Lin Tsai | 2024-11-26 |
| 11437325 | Electronic device, electronic package and packaging substrate thereof | Ho-Chuan Lin, Chih-Yuan Shih, Tsung Li Lin | 2022-09-06 |