Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278173 | Electronic package and substrate structure thereof | Ya-Ting Chi, Chia-Wen Tsao, Hsin-Yin Chang, Yi-Lin Tsai, Hsiu-Fang Chien | 2025-04-15 |
| 12154848 | Electronic package and manufacturing method thereof, and substrate structure | Chia-Wen Tsao, Yi-Lin Tsai, Hsiu-Fang Chien | 2024-11-26 |