Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7342318 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang | 2008-03-11 |
| 7271493 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang | 2007-09-18 |
| 7205642 | Semiconductor package and method for fabricating the same | Chien-Ping Huang, Cheng-Hsu Hsiao | 2007-04-17 |
| 7205674 | Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package | Chien-Ping Huang | 2007-04-17 |
| 6884652 | Semiconductor package free of substrate and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang | 2005-04-26 |
| 6819565 | Cavity-down ball grid array semiconductor package with heat spreader | Nai-Hao Kao, Wen-Jung Chiang | 2004-11-16 |
| 6750067 | Microelectronic piezoelectric structure and method of forming the same | Ramoothy Ramesh, Jeffrey M. Finder, Kurt Eisenbeiser, Zhiyi Yu, Ravindranath Droopad | 2004-06-15 |
| 6750533 | Substrate with dam bar structure for smooth flow of encapsulating resin | Chung-Chi Lin, Chien-Ping Huang | 2004-06-15 |
| 6610560 | Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same | Han-Ping Pu, Caesar Lin | 2003-08-26 |
| 6482538 | Microelectronic piezoelectric structure and method of forming the same | Ramamoorthy Ramesh, Jeffrey M. Finder, Zhiyi Yu, Ravindranath Droopad, Kurt Eisenbeiser | 2002-11-19 |
| 6432546 | Microelectronic piezoelectric structure and method of forming the same | Ramoothy Ramesh, Jeffrey M. Finder, Kurt Eisenbeiser, Zhiyi Yu, Ravindranath Droopad | 2002-08-13 |