Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8741693 | Method for manufacturing package structure with micro-electromechanical element | Chun-An Huang, Hsin-Yi Liao | 2014-06-03 |
| 8680692 | Carrier, semiconductor package and fabrication method thereof | Chiang-Cheng Chang, Meng-Tsung Lee, Jung-Pang Huang | 2014-03-25 |
| 8653661 | Package having MEMS element and fabrication method thereof | Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke | 2014-02-18 |
| 8633048 | Method for fabricating package structure having MEMS elements | CHEN-HAN LIN, Hong-Da Chang, Cheng-Hsiang Liu, Hsin-Yi Liao | 2014-01-21 |
| 8610272 | Package structure with micro-electromechanical element and manufacturing method thereof | Chun-An Huang, Hsin-Yi Liao | 2013-12-17 |
| 8399940 | Package structure having MEMS elements and fabrication method thereof | CHEN-HAN LIN, Hong-Da Chang, Hsin-Yi Liao | 2013-03-19 |
| 8334174 | Chip scale package and fabrication method thereof | Chiang-Cheng Chang, Hsin-Yi Liao, Hsu-Hsi Chang | 2012-12-18 |
| 8288189 | Package structure having MEMS element and fabrication method thereof | Chun-An Huang, Hsin-Yi Liao | 2012-10-16 |
| 8154115 | Package structure having MEMS element and fabrication method thereof | Chang-Yueh Chan, Chien-Ping Huang, Chun-Chi Ke | 2012-04-10 |
| 7485496 | Semiconductor device package with a heat sink and method for fabricating the same | Kun-Sheng Chien, Han-Ping Pu, Cheng-Hsu Hsiao | 2009-02-03 |
| 6856015 | Semiconductor package with heat sink | Chien-Ping Huang, Cheng-Hsu Hsiao | 2005-02-15 |
| 6787918 | Substrate structure of flip chip package | Ying-Chou Tsai, Han-Ping Pu | 2004-09-07 |
| 6692629 | Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer | Chih-Shun Chen, Po-Hao Yuan, Feng-Lung Chien, Ke Yang | 2004-02-17 |
| 6600232 | Flip-chip semiconductor package structure and process for fabricating the same | Ying-Chou Tsai | 2003-07-29 |
| 6506626 | Semiconductor package structure with heat-dissipation stiffener and method of fabricating the same | — | 2003-01-14 |
| 6498054 | Method of underfilling a flip-chip semiconductor device | Ying-Chou Tsai, Han-Ping Pu | 2002-12-24 |
| 6489180 | Flip-chip packaging process utilizing no-flow underfill technique | Ying-Chou Tsai | 2002-12-03 |
| 6459144 | Flip chip semiconductor package | Han-Ping Pu, Keng-Yuan Liao, Chien-Ping Huang | 2002-10-01 |
| 6404064 | Flip-chip bonding structure on substrate for flip-chip package application | Ying-Chou Tsai, Kuo-Liang Mao, Chao-Dung Suo | 2002-06-11 |
| 6396156 | Flip-chip bonding structure with stress-buffering property and method for making the same | Wen-Sen Tang | 2002-05-28 |
| 6391683 | Flip-chip semiconductor package structure and process for fabricating the same | Ying-Chou Tsai | 2002-05-21 |
| 6391682 | Method of performing flip-chip underfill in a wire-bonded chip-on-chip ball-grid array integrated circuit package module | Ying-Chou Tsai | 2002-05-21 |
| 6348740 | Bump structure with dopants | Ying-Chou Tsai, Chao-Dung Suo, Kuo-Liang Mao | 2002-02-19 |