Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715715 | Metal bump structure and manufacturing method thereof and driving substrate | Tzyy-Jang Tseng, Ming-Ru Chen, Cheng-Chung Lo, Chin-Sheng Wang | 2023-08-01 |
| 6396156 | Flip-chip bonding structure with stress-buffering property and method for making the same | Shih-Kuang Chiu | 2002-05-28 |