Issued Patents All Time
Showing 51–75 of 191 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282817 | Semiconductor device package including embedded conductive elements | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Ming-Da Cheng | 2022-03-22 |
| 11282779 | Package structure and fabricating method thereof | Jiun Yi Wu, Yu-Min Liang | 2022-03-22 |
| 11264316 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Chun-Lin Lu | 2022-03-01 |
| 11239096 | Integrated fan-out package and manufacturing method thereof | Chung-Hao Tsai, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2022-02-01 |
| 11233019 | Manufacturing method of semicondcutor package | Fang-Yu Liang, Ching-Feng Yang | 2022-01-25 |
| 11211358 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen +1 more | 2021-12-28 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11183461 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu | 2021-11-23 |
| 11145595 | Integrated fan-out package with antenna components and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Nan-Chin Chuang | 2021-10-12 |
| 11114357 | Methods and apparatus for package with interposers | Chun-Lin Lu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2021-08-24 |
| 11094642 | Package structure | Fang-Yu Liang | 2021-08-17 |
| 11093547 | Data storage based on encoded DNA sequences | Xing Su, Noureddine Tayebi, Grace Credo | 2021-08-17 |
| 11018083 | Semiconductor package and manufacturing method thereof | Tuan-Yu Hung, Ching-Feng Yang, Hung-Jui Kuo, Ming-Che Ho | 2021-05-25 |
| 11004810 | Semiconductor package structure | Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang | 2021-05-11 |
| 11004799 | Package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2021-05-11 |
| 10985117 | Solder ball protection in packages | Chia-Chun Miao, Shih-Wei Liang | 2021-04-20 |
| 10983005 | Spectroscopic overlay metrology | Hung-Chih Hsieh, Kai-Hsiung Chen, Chih-Ming Ke, Yen-Liang Chen | 2021-04-20 |
| 10977933 | Method and apparatus for predicting road conditions based on big data | Dan Zhao, Zhijia Liu, Dengpo Fu | 2021-04-13 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2021-04-06 |
| 10971460 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2021-04-06 |
| 10964595 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Ming-Kai Liu | 2021-03-30 |
| 10950556 | EMI shielding structure in InFO package | Chen-Hua Yu, Ching-Feng Yang, Meng-Tse Chen | 2021-03-16 |
| 10867952 | Semiconductor structure and manufacturing method thereof | Chun-Lin Lu | 2020-12-15 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |