Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046543 | Package substrate and chip package structure using the same | Han-Chieh Hsieh, Chao-Min Lai, Cheng-Chen Huang | 2024-07-23 |
| 12009575 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2024-06-11 |
| 11658392 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2023-05-23 |
| 11553585 | Circuit board and electronic apparatus using the same | Chin-Yuan Lo, Hsin-Hui Lo | 2023-01-10 |
| 11335655 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Shou-Zen Chang | 2022-05-17 |
| 11227854 | Semiconductor package | Chin-Yuan Lo, Chih-Hao Chang | 2022-01-18 |
| 11145595 | Integrated fan-out package with antenna components and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2021-10-12 |
| 11043731 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2021-06-22 |
| 11004810 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu | 2021-05-11 |
| 10998016 | Memory device including noise-suppressing mechanism | Chin-Yuan Lo, Ting-Ying Wu, Hsin-Hui Lo | 2021-05-04 |
| 10867940 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Shou-Zen Chang | 2020-12-15 |
| 10622222 | Integrated fan-out package having multi-band antenna and method of forming the same | Ching-Feng Yang, Kai-Chiang Wu | 2020-04-14 |
| 10553533 | Integrated fan-out package and manufacturing method thereof | Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2020-02-04 |
| 10510693 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Han-Ping Pu | 2019-12-17 |
| 10483617 | Package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2019-11-19 |
| 10475757 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Shou-Zen Chang | 2019-11-12 |
| 10312112 | Integrated fan-out package having multi-band antenna and method of forming the same | Ching-Feng Yang, Kai-Chiang Wu | 2019-06-04 |
| 10186492 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Shou-Zen Chang | 2019-01-22 |