Issued Patents All Time
Showing 26–50 of 79 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11289418 | Package structure and manufacturing method thereof | Chien Ling Hwang, Kai-Chiang Wu | 2022-03-29 |
| 11264316 | Package structure and method of manufacturing the same | Chuei-Tang Wang, Kai-Chiang Wu | 2022-03-01 |
| 11239096 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2022-02-01 |
| 11211358 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2021-12-28 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11183461 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kai-Chiang Wu | 2021-11-23 |
| 11145595 | Integrated fan-out package with antenna components and manufacturing method thereof | Han-Ping Pu, Kai-Chiang Wu, Nan-Chin Chuang | 2021-10-12 |
| 11114357 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2021-08-24 |
| 11004810 | Semiconductor package structure | Kai-Chiang Wu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang | 2021-05-11 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2021-04-06 |
| 10868353 | Electronic device and manufacturing method thereof | Hsiu-Jen Lin, Hsuan-Ting Kuo, Kai-Chiang Wu, Ming-Che Ho, Wei-Yu Chen +8 more | 2020-12-15 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |
| 10867952 | Semiconductor structure and manufacturing method thereof | Kai-Chiang Wu | 2020-12-15 |
| 10825773 | Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same | Chen-Hua Yu, Han-Ping Pu, Kai-Chiang Wu | 2020-11-03 |
| 10770313 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chung-Hao Tsai, Yen-Ping Wang, Che-Wei Hsu | 2020-09-08 |
| 10727082 | Semiconductor device and manufacturing method thereof | Shou-Zen Chang, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2020-07-28 |
| 10692832 | Manufacturing method of semiconductor structure | Kai-Chiang Wu | 2020-06-23 |
| 10665537 | Package structure and manufacturing method thereof | Chien Ling Hwang, Kai-Chiang Wu | 2020-05-26 |
| 10553533 | Integrated fan-out package and manufacturing method thereof | Han-Ping Pu, Kai-Chiang Wu, Nan-Chin Chuang | 2020-02-04 |
| 10529666 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Kai-Chiang Wu | 2020-01-07 |
| 10522437 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang | 2019-12-31 |
| 10510714 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Wei-Ting Chen, Vincent Chen, Shou-Zen Chang +1 more | 2019-12-17 |
| 10510693 | Semiconductor package structure | Kai-Chiang Wu, Chao-Wen Shih, Han-Ping Pu, Nan-Chin Chuang | 2019-12-17 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |