Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9543263 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Yen-Ping Wang | 2017-01-10 |
| 9543373 | Semiconductor structure and manufacturing method thereof | Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao | 2017-01-10 |
| 9497861 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2016-11-15 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Yen-Ping Wang, Kai-Chiang Wu, Ming-Kai Liu | 2016-10-18 |
| 9460989 | Interposer having a defined through via pattern | Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao, Chun-Lin Lu | 2016-10-04 |
| 9461106 | MIM capacitor and method forming the same | Ching-Jung Yang, Chang-Pin Huang, Hsien-Ming Tu, Hao-Yi Tsai, Mirng-Ji Lii +1 more | 2016-10-04 |
| 9437567 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Ying-Ju Chen | 2016-09-06 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Chao-Wen Shih, Yung-Ping Chiang, Tsung-Yuan Yu, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9373599 | Methods and apparatus for package on package devices | Ming-Kai Liu, Kai-Chiang Wu, Hsien-Wei Chen | 2016-06-21 |
| 9355924 | Integrated circuit underfill scheme | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2016-05-31 |
| 9337154 | Semiconductor device and method of manufacturing the same | Chia-Chun Miao, Yen-Ping Wang, Hao-Yi Tsai, Tsung-Yuan Yu | 2016-05-10 |
| 9337117 | Chip package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Tsung-Yuan Yu | 2016-05-10 |
| 9263405 | Semiconductor device | Chia-Chun Miao, Kai-Chiang Wu, Yen-Ping Wang | 2016-02-16 |
| 9224680 | Electrical connections for chip scale packaging | Hsien-Wei Chen | 2015-12-29 |
| 9184143 | Semiconductor device with bump adjustment and manufacturing method thereof | Chia-Chun Miao, Kai-Chiang Wu, Yen-Ping Wang | 2015-11-10 |
| 9082761 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2015-07-14 |
| 9064873 | Singulated semiconductor structure | Chia-Chun Miao, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang | 2015-06-23 |
| 9030010 | Packaging devices and methods | Kai-Chiang Wu, Ming-Che Ho, Yi-Wen Wu | 2015-05-12 |
| 9006891 | Method of making a semiconductor device having a post-passivation interconnect structure | Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Mirng-Ji Lii | 2015-04-14 |
| 8994181 | Bond pad structure to reduce bond pad corrosion | Ying-Ju Chen, Hsien-Wei Chen, Tsung-Yuan Yu | 2015-03-31 |
| 8957503 | Chip package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Tsung-Yuan Yu | 2015-02-17 |
| 8916465 | UBM structures for wafer level chip scale packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Ying-Ju Chen | 2014-12-23 |
| 8912668 | Electrical connections for chip scale packaging | Hsien-Wei Chen | 2014-12-16 |
| 8901730 | Methods and apparatus for package on package devices | Ming-Kai Liu, Hsien-Wei Chen, Kai-Chiang Wu | 2014-12-02 |
| 8871629 | Methods of and semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Ying-Ju Chen | 2014-10-28 |